Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-19T10:28:23.062Z Has data issue: false hasContentIssue false

Moore's Law: A Review of Feature Size Shrinkage and its Effect on Microscopy in the Semiconductor Industry

Published online by Cambridge University Press:  14 March 2018

John Mardinly*
Affiliation:
Intel Corporation, Santa Clara, CA

Summary

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

In 1965, Gordon Moore predicted that the number of components in an integrated circuit would double every year. The drive for higher performance with greater economy has been a major factor in the pursuit of Moore's Law. Device scaling is expected to continue without interruption, and products manufactured using a nominal 22nm feature size should become commercially available by the year 2011. This article will detail the technology enablers that make Moore's Law possible, and the improvements in microscopy techniques required to meet the challenges that Moore's Law presents.

Type
Research Article
Copyright
Copyright © Microscopy Society of America 2007

Footnotes

*

From the proceedings of the Microscopy of Semiconducting Materials XV conference, in press (Springer). With thanks to Drs. A.G Cullis, Paul Midgeley and the Institute of Physics.

References

1. Moore, G E Electronics, Vol. 38 No. 8, April 19, 1965 Google Scholar
4. Jamison, Robert B Experimental and Computational Quantification of Focused Ion Beam Damage in Silicon during TEM Specimen Preparation, Ph.D. Thesis, (University Microfilms) 2000 Google Scholar
5. Yang, Q, Mardinly, J Microscopy and Microanalysis, Vol.8, August 2005 Google Scholar