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A Comparison of Grain Size Measurements in Al-Cu Thin Films: Imaging Vs. Diffraction Techniques

Published online by Cambridge University Press:  14 March 2018

L.M. Gignac
Affiliation:
IBM T.J. Watson Research Center
C.E. Murray
Affiliation:
IBM T.J. Watson Research Center
K.P. Rodbell
Affiliation:
IBM T.J. Watson Research Center
M. Gribelyuk*
Affiliation:
IBM Microelectronics Division

Extract

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Numerous microscopy techniques, based on both imaging and diffraction, exist for the measurement of grain size distributions in polycrystalline thin-film samples. The accuracy of each technique is affected by three major factors: the effective resolution of the instrument relative to the characteristic grain size, the detection of the grain size through the thickness of the film, and the recognition of boundaries between adjacent grains during post-processing. When the instrument resolution is primarily considered, the measurement technique has a practical grain size measurement range, see Fig. 1 for a comparison of ranges for several measurement techniques. In bulk metallurgy grain size analysis, methodology has been developed to represent 3-dimensionai grain structures from measurements taken on 2-dimensional images.

Type
Research Article
Copyright
Copyright © Microscopy Society of America 2002

References

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