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Combining FIB and Automated Microcleaving Provides Fast, Accurate Cross Sections
Published online by Cambridge University Press: 14 March 2018
Extract
A large part of the preparation of semiconductor samples for SEM and TEM observations involves the creation of cross sections to expose subsurface defects and three-dimensional structure. A powerful new combination of FIB (FEI Company, Hillsboro, Oregon, http://www.feic.com ) with automated microcleaving technology (SELA, Santa Clara, California, http://www. sela.com ) now offers a comprehensive solution for fast, easy and accurate sample preparation.
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- Copyright © Microscopy Society of America 1999
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