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Xe Plasma vs Gallium FIB Delayering

Published online by Cambridge University Press:  05 August 2019

S. Sharang ,
Paul Anzalone  and
Jozef Vincenc Obona
S. Sharang
Affiliation:
TESCAN BRNO s.r.o., Czech Republic.
Paul Anzalone
Affiliation:
TESCAN USA Inc., Warrendale, PA, USA.
Jozef Vincenc Obona
Affiliation:
TESCAN ORSAY Holding a.s., Czech Republic.

Abstract

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Type
Advances in Focused Ion Beam Instrumentation and Techniques
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 904 - 905
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Carleson, P et al. , 40th ISTFA Conf. Proc. (2014).Google Scholar
[2]Alvis, R et al. , 41st ISTFA Conf. Proc. (2015).Google Scholar
[3]Oboňa, JV et al. , EU. Micro. Cong. Proc (2016)Google Scholar
[4]Viswanathan, V, Sharang, et al. , “Precision Xe Plasma FIB Delayering for Physical Failure Analysis of sub-20 nm Microprocessor Devices” (2017)Google Scholar
[5]The authors would like to acknowledge funding support from the Technological Agency of the Czech Republic TE 01020233 (AmiSpec) and also Brenda Prenitzer Ph.D., from Nanospective, Orlando, Florida USA for providing 14nm technology samples for the delayering process.Google Scholar