Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-27T04:32:28.400Z Has data issue: false hasContentIssue false

Transmission Electron Microscope Characterization of Siz Selective Deposition of Si-Nanoparticles

Published online by Cambridge University Press:  02 July 2020

Hai-Ping Wu
Affiliation:
Takayanagi Particle Surface Project, ERATO, Japan Science and Technology Corporation, 3-2-1 Musashino, Akishima-shi, Tokyo, 196-8558, Japan
Kimihiro Nishimura
Affiliation:
Takayanagi Particle Surface Project, ERATO, Japan Science and Technology Corporation, 3-2-1 Musashino, Akishima-shi, Tokyo, 196-8558, Japan
Nouari Kebaili
Affiliation:
Takayanagi Particle Surface Project, ERATO, Japan Science and Technology Corporation, 3-2-1 Musashino, Akishima-shi, Tokyo, 196-8558, Japan
Haruko Fujinuma
Affiliation:
Takayanagi Particle Surface Project, ERATO, Japan Science and Technology Corporation, 3-2-1 Musashino, Akishima-shi, Tokyo, 196-8558, Japan
Kunio Takayanagi
Affiliation:
Takayanagi Particle Surface Project, ERATO, Japan Science and Technology Corporation, 3-2-1 Musashino, Akishima-shi, Tokyo, 196-8558, Japan
Get access

Extract

Nanosized semiconductors have been highly desirable as optoelectronic materials since the discovery of photoluminescence from porous nanostructured silicon. There are many investigations about visible light emission from nanostructured semiconductors, and several studies showed the size dependence of the photoluminescent and electronic property [1], [2]. In order to investigate the size effect of those optical properties of nanoparticles, the size-selection technique is important.

Size-selection of silicon nanoclusters has been carried out by crossing, an Ar molecular beam perpendicularly to the silicon cluster beam. The laser ablation in inert gas method was used for fabricating nanometer-sized silicon. Large size silicon clusters are produced by Nd:YAG laser irradiation of a silicon wafer which was rotating in ablation chamber under He-gas flow. Produced nanoparticles were extracted through a nozzle ( ϕ = 0.6 mm) to a differentially pumped chamber and then skimmed into a high vacuum chamber for size selection and deposition.

Type
Defects in Semiconductors
Copyright
Copyright © Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Maeda., Y.Phys. Rev. B 51 (1994) 1685.Google Scholar
2.van Buuren., T.Dinh., L.N.Chase., L.L.Siekhaus., W.J. and Terminello, L.J.. Phys. Rev. Lett. 80 (1998) 17.CrossRefGoogle Scholar