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Three-Dimensional Reconstruction of Printed Circuit Boards: Comparative Study between 3D Femtosecond Laser Serial Sectioning and Optical Imaging versus 3D X-Ray Computed Tomography

Published online by Cambridge University Press:  22 July 2022

Nicholas May*
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
Hongbin Choi*
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
Adrian Phoulady
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
Pouya Tavousi
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States
Sina Shahbazmohamadi*
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
*
*Corresponding author: [email protected]
*Corresponding author: [email protected]
*Corresponding author: [email protected]

Abstract

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Type
Advanced 3D Imaging and Analysis Methods for New Opportunities in Material Science
Copyright
Copyright © Microscopy Society of America 2022

References

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Asadizanjani, Navid, Tehranipoor, Mark, and Forte, Domenic. “PCB reverse engineering using nondestructive X-ray tomography and advanced image processing.IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 2 (2017): 292-299.Google Scholar
Hunt, J. A., Prasad, P., and Raz, E.. “Automated Serial-Section Polishing Tomography.” In ISTFA 2008, pp. 21-24. ASM International, 2008.Google Scholar
The authors have contributed equally to the manuscript.Google Scholar