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TEM of Nanostructure of Cu and Ti doped Sm-Co magnetic materials

Published online by Cambridge University Press:  01 August 2002

S. Y. Liu
Affiliation:
CLAIM, Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109-2125
J. Zhou
Affiliation:
Center for Materials Research and Analysis, University of Nebraska, Lincoln NE 68588
Y. Liu
Affiliation:
CLAIM, Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109-2125 Center for Materials Research and Analysis, University of Nebraska, Lincoln NE 68588
R. Skomski
Affiliation:
Center for Materials Research and Analysis, University of Nebraska, Lincoln NE 68588
D. J. Sellmyer
Affiliation:
Center for Materials Research and Analysis, University of Nebraska, Lincoln NE 68588

Abstract

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Type
Abstract
Copyright
Copyright © Microscopy Society of America 2002