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Strain measurements in industrial applications: A case study of solder bumps in semiconductor devices

Published online by Cambridge University Press:  30 July 2021

Pawel Nowakowski ,
Mary Ray  and
Paul Fischione
Pawel Nowakowski
Affiliation:
E.A. Fischione Instruments, Inc., United States
Mary Ray
Affiliation:
E.A. Fischione Instruments, Inc., United States
Paul Fischione
Affiliation:
E.A. Fischione Instruments, Inc., United States

Abstract

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Type
Microscopy and Microanalysis for Real World Problem Solving
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 788 - 790
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Wilkinson, A., & Dingley, D. (1991). Acta Metallurgica et Materialia, 39(12), 3047-3055.Google Scholar
Kaboli, S., Demers, H., Brodusch, N., & Gauvin, R. (2013). Microscopy and Microanalysis, 19(S2), 1756-1757.CrossRefGoogle Scholar
Vaudin, M., Stan, G., Gerbig, Y., & Cook, R. (2011). Ultramicroscopy, 111(8), 1206-1213.CrossRefGoogle Scholar
Wilkinson, A. J., Gonzalez, G., & Dingley, D. J. (1993). Journal of Microscopy, 169(2), 255-261.CrossRefGoogle Scholar
Kamaya, M., Wilkinson, A. J., & Titchmarsh, J. M. (2005). Nuclear Engineering and Design, 235(6), 713-725.CrossRefGoogle Scholar
Schwartz, A. J., Kumar, M., & Adams, B. L. (Eds.), Electron backscatter diffraction in materials science (2nd ed., pp. 247-264). Boston: Springer.Google Scholar
Ørsund, R., Hjelen, J., & Nes, E. (1989). Scripta Metallurgica, 23(7), 1193-1197.CrossRefGoogle Scholar
Troost, K. Z., Van der Sluis, P., & Gravesteijn, D. J. (1993). Applied Physics Letters, 62(10), 1110-1112.CrossRefGoogle Scholar
Wilkinson, A. J. (1996). Ultramicroscopy, 62(4), 237-247.CrossRefGoogle Scholar
Wilkinson, A. J., Meaden, G., & Dingley, D. J. (2006). Ultramicroscopy, 106(4-5), 307-313.CrossRefGoogle Scholar
Britton, T., & Wilkinson, A. (2011). Ultramicroscopy, 111(8), 1395-1404.CrossRefGoogle Scholar
Nowakowski, P., Schlenker, J., Ray, M., & Fischione, P. (2016). Microscopy and Microanalysis, 22(S3), 12-13.Google Scholar
Nowakowski, P., Bonifacio, C., Ray, M., & Fischione, P. (2019). Microscopy and Microanalysis, 25(S2), 688-689.CrossRefGoogle Scholar
In ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis. Materials Park, OH: ASM International.Google Scholar
Nowakowski, P., Wiezorek, J., Bathula, V., Mielo, S., Khanal, S., Bonifacio, C., & Fischione, P. (2018). Microscopy and Microanalysis, 24(S1), 2182-2183.CrossRefGoogle Scholar
Nowakowski, P., Wiezorek, J., Spinelli, I., Ray, M., & Fischione, P. (2019). Microscopy and Microanalysis, 25(S2), 534-535.CrossRefGoogle Scholar