Standard Free Thickness Determination of Thin TEM Samples via Backscatter Electron Image Correlation

R Salzer; A Graff; M Simon; F Altmann

doi:10.1017/S1431927609096457

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Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009

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Marz, B. Graff, A. Klengel, R. and Petzold, M. 2012. Investigation of the palladium distribution in the intermetallic phase region of Au-Al wire bond interconnects. p. 1.

Lechner, Lorenz Biskupek, Johannes and Kaiser, Ute 2012. Improved Focused Ion Beam Target Preparation of (S)TEM Specimen—A Method for Obtaining Ultrathin Lamellae. Microscopy and Microanalysis, Vol. 18, Issue. 2, p. 379.

van Mierlo, Willem Geiger, Dorin Robins, Alan Stumpf, Matthias Ray, Mary Louise Fischione, Paul and Kaiser, Ute 2014. Practical aspects of the use of the X2 holder for HRTEM-quality TEM sample preparation by FIB. Ultramicroscopy, Vol. 147, Issue. , p. 149.

Volkenandt, Tobias Perez-Willard, Fabian Rauscher, Michael and Maria Anger, Pascal 2017. Towards Automatic Lamella Thinning Using Live Thickness Measurements and Smart End-Point Detection. Microscopy and Microanalysis, Vol. 23, Issue. S1, p. 304.

Rakowski, Alexander Tillotson, Evan Rooney, Aidan and Haigh, Sarah 2019. Two Methods for Measuring Lamellae Thicknesses In situ for Improved FIB Specimen Preparation. Microscopy and Microanalysis, Vol. 25, Issue. S2, p. 858.

CONLAN, A.P. TILLOTSON, E. RAKOWSKI, A. COOPER, D. and HAIGH, S.J. 2020. Direct measurement of TEM lamella thickness in FIB‐SEM. Journal of Microscopy, Vol. 279, Issue. 3, p. 168.

Wang, Hongguang Srot, Vesna Fenk, Bernhard Laskin, Gennadii Mannhart, Jochen and van Aken, Peter A. 2021. An optimized TEM specimen preparation method of quantum nanostructures. Micron, Vol. 140, Issue. , p. 102979.

Tsurusawa, Hideyo Uzuhashi, Jun Kozuka, Yusuke Kimoto, Koji and Ohkubo, Tadakatsu 2024. Robust Preparation of Sub‐20‐nm‐Thin Lamellae for Aberration‐Corrected Electron Microscopy. Small Methods, Vol. 8, Issue. 9,

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Standard Free Thickness Determination of Thin TEM Samples via Backscatter Electron Image Correlation

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