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Selectively Electron-Transparent Microstamping Toward Concurrent Digital Image Correlation and High-Angular Resolution Electron Backscatter Diffraction (EBSD) Analysis

Published online by Cambridge University Press:  04 December 2017

Timothy J. Ruggles ,
Geoffrey F. Bomarito ,
Andrew H. Cannon  and
Jacob D. Hochhalter
Timothy J. Ruggles*
Affiliation:
National Institute of Aerospace, Hampton, VA, USA
Geoffrey F. Bomarito
Affiliation:
Langley Research Center, National Aeronautics and Space Administration, Hampton, VA, USA
Andrew H. Cannon
Affiliation:
1900 Engineering, LLC, Clemson, SC, USA Department of Chemical and Biomolecular Engineering, Clemson University, Clemson, SC, USA
Jacob D. Hochhalter
Affiliation:
Langley Research Center, National Aeronautics and Space Administration, Hampton, VA, USA
*
*Corresponding author. [email protected]
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Abstract

Digital image correlation (DIC) in a scanning electron microscope and high-angular resolution electron backscatter diffraction (HREBSD) provide valuable and complementary data concerning local deformation at the microscale. However, standard surface preparation techniques are mutually exclusive, which makes combining these techniques in situ impossible. This paper introduces a new method of applying surface patterning for DIC, namely a urethane microstamp, that provides a pattern with enough contrast for DIC at low accelerating voltages, but is virtually transparent at the higher voltages necessary for HREBSD and conventional EBSD analysis. Furthermore, microstamping is inexpensive and repeatable, and is more suitable to the analysis of patterns from complex surface geometries and larger surface areas than other patterning techniques.

Keywords

high-angular resolution EBSDEBSDdigital image correlationlithographymicrostamping
Type
Materials Science Applications
Information
Microscopy and Microanalysis , Volume 23 , Issue 6 , December 2017 , pp. 1091 - 1095
Copyright
© Microscopy Society of America 2017 

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