Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-26T12:59:47.286Z Has data issue: false hasContentIssue false

Quantitative Aspects of PLAD Sidewall Doping Characterization by SIMS and APT

Published online by Cambridge University Press:  14 November 2018

Get access

Abstract

Application of atom probe tomography (APT) and 1.5D secondary ion mass spectrometry (SIMS) as complimentary techniques to study fin sidewall doping by plasma implantation (PLAD) is the focus of this paper. Unlike planar transistors, characterization of 3D devices both by SIMS and APT requires sample preparation via trench backfill with α-Si, or other material, via chemical vapor deposition or atomic layer deposition process due to high aspect ratio of test structures. Certain artifacts with adverse impacts on quantitative results encountered in this study are discussed.

Type
Materials Science: Non-Metals
Copyright
Copyright © Microscopy Society of America 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Akey, A and Bell, D (2017) Interlaboratory study: Laser-assisted atom probe tomography of a phosphorus-doped silicon specimen. Microsc Microanal 23(issue S1), 624625.Google Scholar
Gault, B, Danoix, F, Hoummada, K, Mangelinck, D and Leitner, H (2012) Impact of directional walk on atom probe microanalysis. Ultramicroscopy 113, 182191.Google Scholar
Gault, B, Moody, MP, De Geuser, F, La Fontaine, A, Stephenson, LT, Haley, D and Ringer, SP (2010) Spatial resolution in atom probe tomography. Microsc Microanal 16(1), 99110.Google Scholar
International Technology Roadmap for Semiconductors (2011) Front End Process, ITRS 2011 ed. Available at https://www.semiconductors.org/resources/2011-international-technology-roadmap-for-semiconductors-itrs/ (retrieved on August 21, 2011).Google Scholar
Meirer, F, Demenev, E, Giubertoni, D, Vanzetti, L, Gennaro, S, Fedrizzi, M, Pepponi, G, Steinhauser, G, Vishwanath, V, Foad, M and Bersani, M (2014) Surface evolution of very high dose arsenic implants in silicon formed by plasma immersion ion implantation – A long term study. Phys Status Solidi C11(1), 2831.Google Scholar
Meirer, F, Giubertoni, D, Demenev, E, Vanzetti, L, Gennaro, S, Fedrizzi, M, Pepponi, G, Mehta, A, Pianetta, P, Steinhauser, G, Vishwanath, V, Foad, M and Bersani, M (2012) Formation of arsenolite crystals at room temperature after very high dose of arsenic implantation in silicon. Appl Phys Lett 101, 232107-1-232107-4.Google Scholar
Meisenkothen, F, Steel, E, Prosa, T, Henry, K and Prakash Kolli, R (2015) Effects of detector dead-time on quantitative analyses involving boron and multi-hit detection events in atom probe tomography. Ultramicroscopy 159, 101111.Google Scholar
Mody, J, Duffy, R, Eyben, P, Goossens, J, Moussa, A, Polspoel, W, Berghmans, B, van Dal, MJH, Pawlak, BJ, Kaiser, M, Weemaes, RGR and Vandervorst, W (2010) Experimental studies of dose retention and activation in fin field-effect-transistor-based structures. J Vac Sci Technol B 28, C1H5C1H13.Google Scholar
Prosa, TJ, Olson, D, Geiser, B, Larson, DJ, Henry, K and Steel, E (2013) Analysis of silicon dopant profiles. Ultramicroscopy 132, 179185.Google Scholar
Song, Y, Zhou, H, Xu, Q, Luo, J, Yin, H, Yan, J and Zhong, H (2011) Mobility enhancement technology for scaling of CMOS devices: Overview and status. J Electron Mater 40, 1584.Google Scholar
Steen, C, Martinez-Limia, A, Pichler, P, Ryssel, H, Paul, S, Lerch, W, Pei, L, Duscher, G, Seberac, F, Cristiano, F and Windl, W (2008) Distribution and segregation of arsenic at the SiO2/Si interface. J Appl Phys 104, 023518.Google Scholar
Sun, Z, Hazut, O, Yerushalmi, R, Lauhon, LJ and Seidman, DN (2017) Criteria and considerations for preparing atom-probe tomography specimens of nanomaterials using an encapsulation methodology. Ultramicroscopy 184, 225233.Google Scholar
Van den Berg, JA, Rossall, AK and England, J (2018) Arsenic plasma doping in Si characterized by high resolution medium energy ion scattering depth profile analysis. In IIT 2018 Conference (to be published).Google Scholar
Vandervorst, W, Everaert, JL, Rossel, E, Jurczak, M, Hoffman, T, Eyben, P, Mody, J, Zschatzch, G, Koelling, S, Golbert, M, Poon, T, del Agua Borniduel, J, Foad, M, Duffy, R and Pawlak, BJ (2008) Conformal doping of FINFETs: A fabrication and metrology challenge. AIP Conf Proc 1066, 449456.Google Scholar
Vandervorst, W, Fleischmann, C, Bogdanowicz, J, Franquet, A, Celano, U, Paredis, K and Budrevich, A (2017) Dopant composition and carrier profiling for 3D structures. Mater Sci Semicond Process 62, 3148.Google Scholar
Vurpillot, F, Houard, J, Vella, A and De Conihout, B (2009) Thermal response of a field emitter subjected to ultra-fast laser illumination. J Phys D Appl Phys 42, 125502.Google Scholar
Wang, C, Tang, S, Han, K, Persing, H, Maynard, H and Salimian, S (2014) A plasma doping process for 3D finFET source/drain extensions. In 20th International Conference on Ion Implantation Technology (IIT), 26 June – 4 July, 2014, pp. 14. Portland, OR Piscataway, NJ: IEEE.Google Scholar