Hostname: page-component-78c5997874-m6dg7 Total loading time: 0 Render date: 2024-11-16T17:24:13.926Z Has data issue: false hasContentIssue false
  • English
  • Français

Orientation Imaging Microscopy in the TEM

Published online by Cambridge University Press:  02 July 2020

P. Baggethun  and
H. Weiland
P. Baggethun
Affiliation:
Alcoa Technical Center, Alcoa Center, PA15069, USA
H. Weiland
Affiliation:
Alcoa Technical Center, Alcoa Center, PA15069, USA
Get access

Extract

There is a range of techniques now available for the study of crystallographic orientation in materials. Among these, Orientation Imaging Microscopy (OIM) for the SEM is being increasingly applied. This technique is, however, limited by the spatial resolution of the SEM (∼0.5 μm). TEM orientation measurements and imaging provides the necessary alternative to SEM measurements due to the much higher spatial resolution of the TEM (∼10 μm). In TEM crystal orientation measurements Kikuchi patterns are preferred over selected area spot patterns due to higher accuracy and spatial resolution. The earliest means of automation of TEM orientation measurements involved the use of digital scanners and beam deflection measurment for computerized semi-automatic indexing of the patterns. In recent years fully automatic on-line orientation determination has been developed. This has come about as a result of the advances in image processing for automatic indexing of backscatter Kikuchi patterns in the SEM, and the emergence of slow-scan CCD cameras with a large dynamic range.

Type
Electron Diffraction in the TEM
Information
Microscopy and Microanalysis , Volume 5 , Issue S2: Proceedings: Microscopy & Microanalysis '99, Microscopy Society of America 57th Annual Meeting, Microbeam Analysis Society 33rd Annual Meeting, Portland, Oregon August 1-5, 1999 , August 1999 , pp. 204 - 205
Copyright
Copyright © Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Adams, B. L., Wright, S. I. and Kunze, K., Met. Trans. 24a(1993), p819.CrossRefGoogle Scholar

2. Ryder, P. L. and Pitch, W., Phil. Mag. 18(1968), p807.CrossRefGoogle Scholar

3. Heilmann, P., Clark, W. A. T. and Rigney, D. A., Ultramicroscopy 9(1982), p365.CrossRefGoogle Scholar

4. Weiland, H. and Schwarzer, R., Conf. Proc. 7th Int. Conf. on Textures of Materials (ICOTOM 7), Holland 1984, p857Google Scholar

5. Zaefferer, S. and Schwarzer, R., Z. Metallkd. 85(1994), p585.Google Scholar

6. Weiland, H. and Field, D.P., Proc. 52nd Annual Meeting of the Microscopy Society of America, Eds.: Bailey, G.W. and Garett-Reed, A.J., San Francisco Press, 1994, p900Google Scholar

7. Krieger Lassen, N. C., 16th Risø International Symposium on Materials Science, Eds: Hansen, N.et al, Risø Natl. Lab., Roskilde, Denmark 1995, p215Google Scholar

8. Ferry, M. and Humphreys, F. J., Acta Mater 44(1996), p3089CrossRefGoogle Scholar

9. AMT camera system, Advanced Microscopy Techniques CorporationGoogle Scholar

10. Generated by OIM 2.5, TexSEM LaboratoriesGoogle Scholar

11. The authors are grateful to Dr. M. Ferry and Professor F. J. Humphreys for providing the single crystal specimen.Google Scholar