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Multiple Ion Plasma FIB Application for Editing Laser Chips to Enable Live Monitoring of the Semiconductor Material Failure.

Published online by Cambridge University Press:  22 July 2022

Lolita Rotkina ,
Yihan Xiong ,
Ching-Long Jiang  and
Stewart McDougall
Lolita Rotkina
Affiliation:
TRUMPF Photonics Inc. USA, Cranbury, NJ, United States
Yihan Xiong
Affiliation:
TRUMPF Photonics Inc. USA, Cranbury, NJ, United States
Ching-Long Jiang
Affiliation:
TRUMPF Photonics Inc. USA, Cranbury, NJ, United States
Stewart McDougall
Affiliation:
TRUMPF Photonics Inc. USA, Cranbury, NJ, United States

Abstract

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Type
Advances in Focused Ion Beam Instrumentation, Applications and Techniques in Materials and Life Sciences
Information
Microscopy and Microanalysis , Volume 28 , Supplement S1 , August 2022 , pp. 84 - 85
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Copyright
Copyright © Microscopy Society of America 2022

References

Zhang, Q et al. , Sci. Rep. 6, p. 19011.10.1038/srep19011CrossRefGoogle Scholar
Sin, Y, LaLumondiere, S, and Ives, N, Proc. SPIE 11668 (2021).Google Scholar
Sin, Y et al. , EEE 23(6) (2017), p. 1500813.Google Scholar
Ray, V et al. , ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis (2016), Fort Worth, Texas, USAGoogle Scholar
Rotkina, L, Users group meeting at ISTFA 2021.Google Scholar
Authors acknowledge CAMCOR lab at the University of Oregon for providing the opportunity on using the Ion Plasma FIB and keeping us as the users. Special thank you to the FIB manager Valerie Brogden for her assistance in remote access sessions on the FIB.Google Scholar