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Millimeter-scale, Large Uniform Area Semiconductor Device Delayering for Physical Failure Analyses and Quality Control
Published online by Cambridge University Press: 22 July 2022
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- Copyright © Microscopy Society of America 2022
References
Lin, C, Li, Y, Hsu, K, 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (2021), p.1-4. doi:10.1109/ipfa53173.2021.9617324Google Scholar
Wang, DD, Huang, YM, Tan, PK, Feng, H, Low, GR, Yap, HH, … Mai, ZH, AIP Advances 5(12), (2015), p. 127101-9. doi:10.1063/1.4936941CrossRefGoogle Scholar
Bonora, AC, Microelectronics Reliability 17(3) (1978), p. 356. doi:10.1016/0026-2714(78)91239-8Google Scholar
Yap, H, Tan, P, Low, G, Dawood, M, Feng, H, Zhao, Y … Mai, Z, Microelectronics Reliability 55(9-10) (2015), p. 1611-1616. doi:10.1016/j.microrel.2015.06.037CrossRefGoogle Scholar
Sharang, S, Anzalone, P, Obona, JV, Microscopy and Microanalysis 25(S2) (2019), p. 904-905. doi:10.1017/s1431927619005257CrossRefGoogle Scholar
Alvis, R, Landin, T, Rue, C, Carleson, P, Sidorov, O, Erickson, A, Chu, C, International Symposium for Testing and Failure Analysis (2015), p. 388-400. doi.org/10.31399/asm.cp.istfa2015p0388Google Scholar
Zudhistira, D, Viswanathan, V, Narang, V, Chin, J, Sharang, S, Novotny, K, Obona, JV, International Symposium for Testing and Failure Analysis (2017), p. 574-579. doi:10.31399/asm.cp.istfa2017p0574Google Scholar
Nowakowski, P, Boccabella, M, Ray, M, Fischione, P, International Symposium for Testing and Failure Analysis (2018), p. 520-524. doi:10.31399/asm.cp.istfa2018p0520Google Scholar
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