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In Situ EBSD Study on the Microstructural Transformation of the Ni5W Substrate for Coated Conductors

Published online by Cambridge University Press:  18 January 2021

Xinyu Wu ,
Hongli Suo ,
Jiazhi Li ,
Yaotang Ji ,
Lin Ma ,
Min Liu ,
Yinming Dai ,
Jianhua Liu  and
Zili Zhang
Xinyu Wu
Affiliation:
Key Laboratory of Advanced Functional Materials, Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing100124, China
Hongli Suo*
Affiliation:
Key Laboratory of Advanced Functional Materials, Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing100124, China
Jiazhi Li
Affiliation:
Key Laboratory of Advanced Functional Materials, Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing100124, China
Yaotang Ji
Affiliation:
Key Laboratory of Advanced Functional Materials, Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing100124, China
Lin Ma
Affiliation:
Key Laboratory of Advanced Functional Materials, Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing100124, China
Min Liu
Affiliation:
Key Laboratory of Advanced Functional Materials, Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing100124, China
Yinming Dai
Affiliation:
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing100190, China
Jianhua Liu
Affiliation:
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing100190, China
Zili Zhang*
Affiliation:
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing100190, China
*
*Authors for correspondence: Hongli Suo, E-mail: [email protected] and Zili Zhang, E-mail: [email protected]
*Authors for correspondence: Hongli Suo, E-mail: [email protected] and Zili Zhang, E-mail: [email protected]
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Abstract

The microstructure and texture evolution of Ni-5 at%W (Ni5W) alloy substrates were investigated by in situ tensile testing along the rolling direction (RD), transverse direction (TD), and at 45° to the RD (45°-RD), as well as by electron backscatter diffraction characterization. The tensile stress direction had a significant influence on the texture evolution. The cubic texture in the Ni-5 at%W alloy exhibited severe degradation when the tensile angle was 45°-RD. In contrast, the cubic texture was relatively stable under high deformation along the RD or TD. It was found that the slip line system in the 45°-RD specimen was the key to the contrasting behavior. The effect of the tensile testing angle on the cubic texture evolution for Ni–W substrates was investigated, and the corresponding effect on the superconducting properties of coated materials was studied.

Keywords

coated conductorcubic textureelectron backscatter diffractionplastic deformation
Type
Materials Science Applications
Information
Microscopy and Microanalysis , Volume 27 , Issue 1 , February 2021 , pp. 36 - 43
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

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