Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-27T04:43:25.660Z Has data issue: false hasContentIssue false
  • English
  • Français

FIB sample preparation for X-ray microscopy and ROI target cross-sectioning

Published online by Cambridge University Press:  25 July 2016

Ehrenfried Zschech ,
Jürgen Gluch ,
Rüdiger Rosenkranz ,
Yvonne Standke  and
Sven Niese
Ehrenfried Zschech
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Jürgen Gluch
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Rüdiger Rosenkranz
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Yvonne Standke
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Sven Niese
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany now with AXO Dresden GmbH, Dresden, Germany

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 22 , Supplement S3: Proceedings of Microscopy & Microanalysis 2016 , July 2016 , pp. 168 - 169
Copyright
© Microscopy Society of America 2016 

References

References:

[1] Merkle, A. P. & Gelb, J. “Ascent of 3D X-ray Microscopy in the Laboratory”, Microscopy Today 21 (2013) 10–15.Google Scholar
[2] Kong, L. W., Lloyd, J. R., Yeap, K. B., Zschech, E., Rudack, A., Liehr, M. & Diebold, A. “Applying X- ray Microscopy and Finite Element Modelling to Identify the Mechanism of Stress-Assisted Void Growth in Through Silicon Vias”. J. Appl. Phys 110 (2011) 053502.Google Scholar
[3] Knickerbocker, J. U., Kong, L. W., Niese, S., Diebold, A. & Zschech, E. “3D Interconnect Technology”. in “Advanced Interconnects for ULSI Technology” (Eds. M. Baklanov, P. S. Ho & E. Zschech, (John Wiley & Sons Chichester (2012). pp. 437–502.Google Scholar
[4] Kwakman, L., Franz, G., Taklo, M., Klumpp, A. & Ramm, P. “Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system”. AIP Conf. Proc 1395 (2011) 269.Google Scholar
[5] Stegmann, H., Domer, H., Rosenkranz, R. & Zschech, E. “Efficient Target Preparation by Combined Pulsed Laser Ablation and FIB Milling”. Microscopy and Microanalysis 17 (2011) 658–659.CrossRefGoogle Scholar