Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-05T13:28:49.163Z Has data issue: false hasContentIssue false
  • English
  • Français

Evaluation of Grain Growth and Bonding in Roll Bonded Aluminum Alloy Plates

Published online by Cambridge University Press:  01 August 2005

E A Kenik ,
T J Huxford ,
J R Mayotte ,
T S Nedkova  and
J D Sease
E A Kenik
Affiliation:
Oak Ridge National Laboratory
T J Huxford
Affiliation:
Oak Ridge National Laboratory
J R Mayotte
Affiliation:
Oak Ridge National Laboratory
T S Nedkova
Affiliation:
Oak Ridge National Laboratory
J D Sease
Affiliation:
Oak Ridge National Laboratory

Extract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

Extended abstract of a paper presented at Microscopy and Microanalysis 2005 in Honolulu, Hawaii, USA, July 31--August 4, 2005

Type
Research Article
Information
Microscopy and Microanalysis , Volume 11 , Issue S02 , August 2005 , pp. 1840 - 1841
Copyright
© 2005 Microscopy Society of America