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Direct-Writing of Cu Nano-Patterns with an Electron Beam

Published online by Cambridge University Press:  18 September 2015

Shih-En Lai ,
Ying-Jhan Hong ,
Yu-Ting Chen ,
Yu-Ting Kang ,
Pin Chang  and
Tri-Rung Yew
Shih-En Lai
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Ying-Jhan Hong
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Yu-Ting Chen
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Yu-Ting Kang
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Pin Chang
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
Tri-Rung Yew*
Affiliation:
Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan, R.O.C.
*
*Corresponding author.[email protected]
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Abstract

We demonstrate direct electron beam writing of a nano-scale Cu pattern on a surface with a thin aqueous layer of CuSO4 solution. Electron beams are highly maneuverable down to nano-scales. Aqueous solutions facilitate a plentiful metal ion supply for practical industrial applications, which may require continued reliable writing of sophisticated patterns. A thin aqueous layer on a surface helps to confine the writing on the surface. For this demonstration, liquid sample holder (K-kit) for transmission electron microscope (TEM) was employed to form a sealed space in a TEM. The aqueous CuSO4 solution inside the sample holder was allowed to partially dry until a uniform thin layer was left on the surface. The electron beam thus reduced Cu ions in the solution to form the desired patterns. Furthermore, the influence of e-beam exposure time and CuSO4(aq) concentration on the Cu reduction was studied in this work. Two growth stages of Cu were shown in the plot of Cu thickness versus e-beam exposure time. The measured Cu reduction rate was found to be proportional to the CuSO4(aq) concentration.

Keywords

electron beam-induced depositiondirect writingCu patternliquid cellelectron microscopy
Type
Equipment and Techniques Development
Information
Microscopy and Microanalysis , Volume 21 , Supplement 6 , December 2015 , pp. 1639 - 1643
Copyright
© Microscopy Society of America 2015 

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Footnotes

a

These authors contributed equally to this work.

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