Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-27T10:47:50.155Z Has data issue: false hasContentIssue false
  • English
  • Français

Developing Multifunctional and High Resolution In-situ TEM Holders

Published online by Cambridge University Press:  05 August 2019

Songhua Cai ,
Mingjie Xu ,
Sheng Dai ,
Peng Wang  and
Xiaoqing Pan
Songhua Cai
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Mingjie Xu
Affiliation:
Department of Materials Science and Engineering, University of California - Irvine, Irvine, CA, USA.
Sheng Dai
Affiliation:
Department of Materials Science and Engineering, University of California - Irvine, Irvine, CA, USA.
Peng Wang
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Xiaoqing Pan
Affiliation:
Department of Materials Science and Engineering, University of California - Irvine, Irvine, CA, USA. Department of Physics and Astronomy, University of California - Irvine, Irvine, CA, USA.

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
In situ TEM of Nanoscale Materials and Electronic Devices for Phase Transformation Studies
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 1854 - 1855
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Boston, R., et al. , Science 344 (2014), p. 623.Google Scholar
[2]Espinosa, H.D., et al. , Small 8 (2012), p. 3233.Google Scholar
[3]Cai, S.H., et al. , Ultramicroscopy 194 (2018), p. 57.Google Scholar
[4]Xu, M.J., et al. , Ultramicroscopy 192 (2018), p. 1.Google Scholar
[5]Wang, M., et al. , Nature Electronics 1 (2018), p. 130.Google Scholar