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The Crystallography of Co-Alloy Magnetic Media Grown on NiAl Underlayers: Two-&-a-Quarter-D Isotropy Due to Multiplicity of Hexagonal & Cubic Structures

Published online by Cambridge University Press:  02 July 2020

Warren J. MoberlyChan  and
Paul Dorsey
Warren J. MoberlyChan
Affiliation:
MCbyMC, Berkeley, CA
Paul Dorsey
Affiliation:
Komag, Inc., San Jose, CA, 95131, USA
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Hard drives in portable computers require media deposited on glass substrates and employ NiAl as the first seed layer to optimize magnetic performance. From observations of a 112 XRD peak [1], a <112> texture has been reported to develop as sputtered films of NiAl thicken; however, synchrotron analysis observes additional cubic peaks [2]. The electron diffraction in this study detects no dominant <112> orientation in NiAl, but rather that the NiAl films (and subsequent cubic underlayers) are closer to 3-D isotropic. Furthermore, the +/-20° range of ﹛1100﹜ orientations observed [3] in the Co media grains grown on NiAl/Cr occurs not because of one (or two) special zone axis relationship(s), nor due to substrate surface finish, but rather as a consequence of multiplicity relationships between the cubic and hexagonal crystals. Although an “increase” in variants is often accepted for an upper film (e.g. bicrystals of [1120] Co on [200] Cr),

Type
Films and Coatings
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 448 - 449
Copyright
Copyright © Microscopy Society of America

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References

References:

[1]Zou, J., Laughlin, D., & Lambeth, D., IEEE V34, 1582–4 (1998).Google Scholar
[2]Khanna, G., et al, presented at MMM San Jose (1999), in press IEEE.Google Scholar
[3]Li, J., et al, presented MMM Miami (1998), in press IEEE.Google Scholar
[4]MoberlyChan, W. J., et al, Microscopy, V4 (2), Springer, 344 (1998).Google Scholar
[6] NCEM at LBL is thanked for the use of their computer facilities; and the Materials Science & Engineering Dept. at Stanford University is gratefully acknowledged for the use of their TEM.Google Scholar