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Creating Single Boundary between Two CdTe (111) Wafers with Controlled Orientation by Wafer Bonding

Published online by Cambridge University Press:  27 August 2014

Ce Sun ,
Ning Lu ,
Guoda Lian ,
Jinguo Wang ,
Xin Peng ,
Robert F. Klie  and
Moon J. Kim
Ce Sun
Affiliation:
Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson,Texas 75080, USA
Ning Lu
Affiliation:
Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson,Texas 75080, USA
Guoda Lian
Affiliation:
Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson,Texas 75080, USA
Jinguo Wang
Affiliation:
Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson,Texas 75080, USA
Xin Peng
Affiliation:
Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson,Texas 75080, USA
Robert F. Klie
Affiliation:
Department of Physics, University of Illinois at Chicago, Chicago, Illinois 60607, USA
Moon J. Kim
Affiliation:
Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson,Texas 75080, USA

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 20 , Supplement S3: Proceedings of Microscopy & Microanalysis 2014 , August 2014 , pp. 516 - 517
Copyright
Copyright © Microscopy Society of America 2014 

References

References:

[1] Wood, EL, Sansoz, F Nanoscale 4 (2012) p. 5268.Google Scholar
[2] Alexw, M, Gosele, U in “Wafer Bonding” (Springer, 2004).Google Scholar
[3] Sun, C, et al, Appl Phys Lett 103 (2013)p. 252104.Google Scholar
[4] This work was supported by Leading Foreign Research Institute Recruitment Program through NRF funded by MSIP, Korea (2013K1A4A3055679) and the DOE BRIDGE (DE-EE0005956).Google Scholar