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Combining Emerging Sample Preparation Methods, SEM, and TEM Investigations for Microelectronics Device Characterization at Multiple Scales

Published online by Cambridge University Press:  05 August 2019

Pawel Nowakowski ,
Cecile Bonifacio ,
Mary Ray  and
Paul Fischione
Pawel Nowakowski*
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
Cecile Bonifacio
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
Mary Ray
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
Paul Fischione
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
*
*Corresponding author: [email protected]

Abstract

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Type
Microscopy and Microanalysis for Real-World Problem Solving
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 688 - 689
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Schaffer, M, Schaffer, B, and Ramasse, Q, Ultramicroscopy 114 (2012), p. 62.Google Scholar
[2]Simon-Najasek, M et al. , Microelectronics Reliability 54 (2014), p. 1785.Google Scholar
[3]Vieweg, BF et al. , Ultramicroscopy 113 (2012), p. 165.Google Scholar
[4]Šikula, M, Hrnčíř, T, and Gounet, P, Proceedings from the 43rd International Symposium for Testing and Failure Analysis (2017), p. 270.Google Scholar
[5]Hsu, H-C et al. , Proceedings from the 43rd International Symposium for Testing and Failure Analysis (2017), p. 256.Google Scholar