Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-26T13:38:11.986Z Has data issue: false hasContentIssue false
  • English
  • Français

Combination of Soft X-Ray Microscopy with In-Situ Mechanical Testing to Image Crack Propagation in Microchips

Published online by Cambridge University Press:  10 August 2018

Kristina Kutukova ,
Zhongquan Liao ,
Stephan Werner ,
Peter Guttmann ,
Yvonne Standke ,
Jurgen Gluch ,
Gerd Schneider  and
Ehrenfried Zschech
Kristina Kutukova*
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Zhongquan Liao
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Stephan Werner
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-StraBe 5, 12489 Berlin, Germany
Peter Guttmann
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-StraBe 5, 12489 Berlin, Germany
Yvonne Standke
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Jurgen Gluch
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Gerd Schneider
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-StraBe 5, 12489 Berlin, Germany
Ehrenfried Zschech
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
*
*[email protected]

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S2: Proceedings of the 14th International Conference on X-ray Microscopy (XRM2018) , August 2018 , pp. 438 - 439
Copyright
© Microscopy Society of America 2018 

References

References:

[1] Rehbein, S., et al, Optics Express 20, 5830–5839, 2012.Google Scholar
[2] Kutukova, K., et al, MRS Advances, submitted 2018.Google Scholar
[3] Grill, A., et al, Appl. Phys. Rev. 1, 011306 2014.Google Scholar
[4] Natarajan, S., et al, IEEE International Electron Devices Meeting (IEDM), December 2014, San Francisco/CA (2014).Google Scholar
[5] Zhang, X., et al, AIP Conf. Proc. 1143, 197–203, 2009.Google Scholar
[6] Kutukova, K., et al, International FCMN conference, March 2017, Monterey/CA (2017).Google Scholar
[7] The authors thank Oden Warren and Douglas Stauffer (both with Bruker Corporation, Billerica/MA, USA) as well as Martin Gall, Andre Clausner and Christoph Sander (all with Fraunhofer IKTS Dresden, Germany) for helpful discussions. Financial support from SRC under Member-Specific Research Contract P30697 is greatly appreciated.Google Scholar