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Characterizing the intermetallic formed during ball attach process

Published online by Cambridge University Press:  03 October 2008

Paulo Pereira
Affiliation:
Dep. de Engenharia Metalúrgica e de Materiais, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal
Rúben Santos
Affiliation:
Dep. de Engenharia Metalúrgica e de Materiais, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal
Maria M. Barbosa
Affiliation:
Dep. de Engenharia Metalúrgica e de Materiais, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal
Cátia Almeida
Affiliation:
Dep. de Engenharia Metalúrgica e de Materiais, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal

Abstract

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Continuously miniaturization of electronic components using PCB's technology for the manufacturing of SDRAM's uses a solder ball attach process, producing a joint which robustness and electrical response are crucial factors to success. At present, near-eutectic Sn-Ag-Cu alloys are the leading candidates for Pb-free solders. According to Chun et al., the rapid formation of Cu-Sn intermetallic compounds at the interface affects the reliability of this solder joint and represents a major concern. In this study we characterize the interface of an attachment between the copper layer conductors of a memory and a solder ball which allows further bonding to printed circuit modules, see figure 1.a.

Type
Abstract
Copyright
Copyright © Microscopy Society of America 2008