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Characterization of Electrodeposited Copper Films with Time-of-Flight SIMS

Published online by Cambridge University Press:  26 July 2009

H Demers ,
U Emekli ,
E Lifshin  and
AC West
H Demers
Affiliation:
SUNY,Albany
U Emekli
Affiliation:
Columbia University
E Lifshin
Affiliation:
SUNY,Albany
AC West
Affiliation:
Columbia University

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009

Type
Abstract
Information
Microscopy and Microanalysis , Volume 15 , Supplement S2 , July 2009 , pp. 492 - 493
Copyright
Copyright © Microscopy Society of America 2009