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Broad Ion Beam (BIB) Slope Cutting through Sn-Coated Copper Wires for 3D Scanning Electron Microscopy and Microanalysis

Published online by Cambridge University Press:  05 August 2007

W Hauffe
W Hauffe
Affiliation:
Dresden University of Technology,Germany
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Extract

Extended abstract of a paper presented at Microscopy and Microanalysis 2007 in Ft. Lauderdale, Florida, USA, August 5 – August 9, 2007

Type
Research Article
Information
Microscopy and Microanalysis , Volume 13 , Issue S02 , August 2007 , pp. 1526 - 1527
Copyright
© 2007 Microscopy Society of America

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