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Bonding and Stability of Metal/Ceramic Interfaces

Published online by Cambridge University Press:  02 July 2020

U. Alber ,
R. Schweinfest  and
M. Riihle
U. Alber
Affiliation:
Max-Planck-Institut fur Metallforschung, SeestraBe 92, D-70174 Stuttgart, Germany
R. Schweinfest
Affiliation:
Max-Planck-Institut fur Metallforschung, SeestraBe 92, D-70174 Stuttgart, Germany
M. Riihle
Affiliation:
Max-Planck-Institut fur Metallforschung, SeestraBe 92, D-70174 Stuttgart, Germany
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Extract

Metal/ceramic interfaces play a crucial role in materials science and for various industrial purposes. In technical applications these interfaces are often exposed to high temperatures and different atmospheres. This often results in a change of the mechanical stability via the morphology and electronic structure of the interfaces. We present a comprehensive analytical electron microcopy (AEM) and fracture mechanics study of this connection on a metal/ceramic-interface model system: Cu/ α-Al2O3.

The specimens were produced by UHV diffusion bonding of bulk Cu to (α-Al2O3 single crystals. Two different Cu materials were used, either pure Cu (noted: Cu) or Cu containing 83±12 ppm oxygen (noted: Cu(O)). After bonding the interfaces were annealed in an oxygen partial pressure at 1000°C between 20 and 120 h. Four point bending tests showed an increase of the fracture energy for the Cu(O)/α -Al2O3-interfaces compared to the Cu(O)/α-Al2O3-interfaces by a factor of 5±2.

Type
Spatially-Resolved Characterization of Interfaces in Materials
Information
Microscopy and Microanalysis , Volume 4 , Issue S2: Proceedings: Microscopy & Microanalysis '98, Microscopy Society of America 56th Annual Meeting, Microbeam Analysis Society 32nd Annual Meeting, Atlanta, Georgia July 12-16, 1998 , July 1998 , pp. 768 - 769
Copyright
Copyright © Microscopy Society of America

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