Automated Local Texture and Stress Analysis in Cu Interconnects Using D-STEM and Precession Microscopy

KJ Ganesh; S Rajasekhara; D Bultreys; J-P Zhou; PJ Ferreira

doi:10.1017/S1431927610061933

Automated Local Texture and Stress Analysis in Cu Interconnects Using D-STEM and Precession Microscopy

Published online by Cambridge University Press: 01 August 2010

KJ Ganesh ,

S Rajasekhara ,

D Bultreys ,

J-P Zhou and

PJ Ferreira

Show author details

KJ Ganesh: Affiliation:
University of Texas, Austin
S Rajasekhara: Affiliation:
University of Texas, Austin
D Bultreys: Affiliation:
NanoMEGAS SPRL, Belgium
J-P Zhou: Affiliation:
University of Texas, Austin
PJ Ferreira: Affiliation:
University of Texas, Austin

Article contents

Extract

Extract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.

Type: Abstract
Information: Microscopy and Microanalysis , Volume 16 , Supplement S2 , July 2010 , pp. 1728 - 1729

DOI: https://doi.org/10.1017/S1431927610061933 [Opens in a new window]

Article contents

Automated Local Texture and Stress Analysis in Cu Interconnects Using D-STEM and Precession Microscopy

Extract

Save article to Kindle

Save article to Dropbox

Save article to Google Drive

Reply to: Submit a response

Your details

You have entered the maximum number of contributors

Conflicting interests