Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-26T04:27:18.796Z Has data issue: false hasContentIssue false
  • English
  • Français

Accuracy of Spatial Measurements at Elevated Temperatures in an Environmental Scanning Electron Microscope

Published online by Cambridge University Press:  02 July 2020

Richard L. Schalek  and
Lawrence T. Drza
Richard L. Schalek
Affiliation:
Composite Materials and Structures Center, Michigan State University, East Lansing, MI48824
Lawrence T. Drza
Affiliation:
Composite Materials and Structures Center, Michigan State University, East Lansing, MI48824 Department of Chemical Engineering and, Materials Science and Mechanics, Michigan State University, East Lansing, MI48824-1226
Get access

Extract

One of the unique abilities of the environmental scanning electron microscope is that it permits realtime dynamic observations of materials under controlled temperature/atmosphere conditions [1]. The need for accurate and precise measurements of dimensional changes at elevated temperatures arise in many material areas including determining the longitudinal and transverse coefficient of thermal expansion of fibers, sintering studies, hydration and dehydration of absorbent polymers, and strain measurement of materials under an applied load. The purpose of this research is to evaluate the capabilities of an ElectroScan 2020 environmental scanning electron microscope (ESEM™) in performing precise in situ spatial measurements at elevated temperatures. Identification and proposed solution and/or compensation of imaging difficulties such as specimen drift, sample stability, and thermal strain of a reference grid are addressed.

In general, the accuracy of spatial measurements in a scanning electron microscope (SEM) depends on several factors including calibration of the scanned area, the effects of lens hysteresis and reproducibility in the working distance and column alignment.

Type
Environmental Scanning Electron Microscopy and Other Wet Work
Information
Microscopy and Microanalysis , Volume 5 , Issue S2: Proceedings: Microscopy & Microanalysis '99, Microscopy Society of America 57th Annual Meeting, Microbeam Analysis Society 33rd Annual Meeting, Portland, Oregon August 1-5, 1999 , August 1999 , pp. 298 - 299
Copyright
Copyright © Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

references

1.)Link, L.F., Gerristead, W. R. Jr., and Tamhankar, S., “Copper Thick film Sintering Studies in an Environmental Scanning Electron Microscope,” Microscopy Research and Technique 25 518–522 (1993).CrossRefGoogle Scholar
2.)Cousens, D.R., Kinaev, N.N., and Ranasinghe, M., “Reproducibility and Accuracy of Spatial Measurments for Digitally Captured Images in the Environmental Scanning Electron Microscope,” SCANNING, 20, 83–86 (1998).CrossRefGoogle Scholar
3.)Postek, MT, “Critical Issues in Scanning Electron Microscope Metrology,” J. Res. NIST 99(5) 641–671 (1994).CrossRefGoogle Scholar