Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-20T03:32:25.094Z Has data issue: false hasContentIssue false
  • English
  • Français

Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

Published online by Cambridge University Press:  23 November 2012

N. Shishido ,
H. Sugiyama ,
S. Kamiya ,
M. Omiya ,
T. Nagasawa ,
T. Nokuo ,
T. Suzuki  and
T. Nakamura
N. Shishido
Affiliation:
Nagoya Institute of Technology, Nagoya, Japan
H. Sugiyama
Affiliation:
Nagoya Institute of Technology, Nagoya, Japan
S. Kamiya
Affiliation:
Nagoya Institute of Technology, Nagoya, Japan
M. Omiya
Affiliation:
Keio University, Yokohama, Japan
T. Nagasawa
Affiliation:
JEOL Ltd., Akishima, Japan
T. Nokuo
Affiliation:
JEOL Ltd., Akishima, Japan
T. Suzuki
Affiliation:
Fujitsu Laboratories Ltd., Atsugi, Japan
T. Nakamura
Affiliation:
Fujitsu Laboratories Ltd., Atsugi, Japan
Get access

Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.

Type
Research Article
Information
Microscopy and Microanalysis , Volume 18 , Issue S2: Proceedings of Microscopy & Microanalysis 2012 , July 2012 , pp. 766 - 767
Copyright
Copyright © Microscopy Society of America 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)