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Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging

Published online by Cambridge University Press:  06 August 2013

Zhi-Quan Liu ,
Pan-Ju Shang ,
Feifei Tan  and
Douxing Li
Zhi-Quan Liu*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang, Liaoning 110016, China
Pan-Ju Shang
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang, Liaoning 110016, China
Feifei Tan
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang, Liaoning 110016, China
Douxing Li
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang, Liaoning 110016, China
*
*Corresponding author. E-mail: [email protected]; [email protected]
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Abstract

Kirkendall void formation at the solder/metallization interface is an important reliability concern for Cu conductors and under-bump metallization in microelectronic packaging industry, whose mechanism is still hard to be understood for different individual cases. In the present work, two typical solder/Cu-diffusing couples, eutectic SnIn/Cu and SnBi/Cu, were studied by scanning/transmission electron microscopy to investigate the microstructural evolution and voiding process after soldering and then solid-state aging. It was concluded that Kirkendall voids formed between two sublayers within Cu2(In,Sn) phase in eutectic SnIn/Cu solder joint, whereas they appeared at the Cu3Sn/Cu interface or within Cu3Sn for eutectic SnBi/Cu solder joint. Besides the effect of impurity elements, the morphological difference within one intermetallic compound layer could change the diffusing rates of reactive species, hence resulting in void formation in the reaction zone.

Keywords

lead-free solderKirkendall voidintermetallic compound (IMC)diffusioninterfacetransmission electron microscopy (TEM)
Type
Research Article
Information
Microscopy and Microanalysis , Volume 19 , Supplement S5: IUMAS , August 2013 , pp. 105 - 108
Copyright
Copyright © Microscopy Society of America 2013 

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References

Bader, S., Gust, W. & Hieber, H. (1995). Rapid formation of intermetallic compounds interdiffusion in the Cu/Sn and Ni/Sn systems. Acta Metall Mater 43(1), 329–337.Google Scholar
He, M., Chen, Z. & Qi, G. (2004). Solid state interfacial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni–P under bump metallization. Acta Mater 52, 2047–2056.Google Scholar
Kim, J.Y. & Yu, J. (2008a). Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering. Appl Phys Lett 92, 092109.Google Scholar
Kim, J.Y. & Yu, J. (2008b). Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints. Acta Mater 56, 5514–5523.Google Scholar
Laurila, T., Vuorinen, V. & Kivilahti, J.K. (2005). Interfacial reactions between lead-free solders and common base materials. Mater Sci Eng R 49, 1–60.10.1016/j.mser.2005.03.001Google Scholar
Paul, A. (2004). The Kirkendall effect in solid state diffusion. Doctoral Dissertation, Technical University of Eindhoven Press.Google Scholar
Paul, A., van Dal, M.J.H., Kodentsov, A.A. & van Loo, F.J.J. (2004). The Kirkendall effect in multiphase diffusion. Acta Mater 52, 623–630.Google Scholar
Peng, W., Monlevade, E. & Marques, M.E. (2007). Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu. Microelectron Reliab 47, 2161–2168.Google Scholar
Shang, P.J., Liu, Z.Q., Li, D.X. & Shang, J.K. (2008). Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints. Scripta Mater 58, 409–412.Google Scholar
Shang, P.J., Liu, Z.Q., Li, D.X. & Shang, J.K. (2009a). TEM observations of the growth of intermetallic compounds at the SnBi/Cu interface. J Electron Mater 38, 2579–2584.10.1007/s11664-009-0894-0Google Scholar
Shang, P.J., Liu, Z.Q., Li, D.X. & Shang, J.K. (2011). Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging. Phil Mag Lett 91, 410–417.Google Scholar
Shang, P.J., Liu, Z.Q., Pang, X.Y., Li, D.X. & Shang, J.K. (2009b). Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates. Acta Mater 57, 4697–4706.Google Scholar
van Dal, M.J.H., Gusak, A.M., Cserhati, C., Kodentsov, A.A. & van Loo, F.J.J. (2001). Microstructural stability of the Kirkendall plane in solid-state diffusion. Phys Rev Lett 86(15), 3353–3355.Google Scholar
Zeng, K., Stierman, R., Chiu, T.Z., Edwards, D., Ano, K. & Tu, K.N. (2005). Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J Appl Phys 97, 024508.Google Scholar