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Microstructural Response of DS Nb-Silicide In-Situ Composites During High-Temperature Creep Testing

Published online by Cambridge University Press:  02 July 2020

B.P. Bewlay
Affiliation:
General Electric Corporate Research and Development, Schenectady, New York 12301
S.D. Sitzman
Affiliation:
General Electric Corporate Research and Development, Schenectady, New York 12301
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Extract

Directionally solidified (DS) in-situ composites based on (Nb) and Nb silicides, such as Nb5Si3 and Nb3Si, are being investigated for high-temperature structural applications. The use of alloying additions, such as Hf, Ti and Mo, to these silicides is required to enhance their properties. The present paper describes the microstructural response of a DS Nb-silicide based composite to creep testing.

The composites investigated were directionally solidified from a molten alloy using the Czochralski method as described previously. Creep tests were conducted at 1200°C to strains of up 50%. Microstructure and microtexture characterizations were performed using scanning electron microscopy, electron microprobe analysis (EMPA), and electron backscatter diffraction pattern analysis (EBSP).

Microstructures of the longitudinal section of a DS composite generated from a Nb-12.5Hf-33Ti- 16Si alloy are shown in Figure 1 in the as-DS (left hand side) and the DS+creep tested conditions (right hand side).

Type
Phase Transformations
Copyright
Copyright © Microscopy Society of America

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References

1.Bewlay, B.P., Jackson, M.R., and Subramanian, P.R., JOM, April 1999 Vol 51(4), pp. 3236.CrossRefGoogle Scholar
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