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Identification of cu6sn5 and cu10sn3 Phases in Admixed Dispersal Phase Dental Amalgam by High Resolution Trasmission Electron Microscopy Combined with Convergent Beam Electron Diffraction.

Published online by Cambridge University Press:  02 July 2020

Caballero Ramon ,
Quintero Amado  and
Hilders Oswaldo
Caballero Ramon
Affiliation:
Centro de Biornateriales, Facultad de Ingenieria, Universidad Central de Venezuela, Apartado Postal 47711, Los Chaguaramos, 1041Caracas Venezuela.
Quintero Amado
Affiliation:
Department of Chemical, Biochemical and Materials Engineering, Stevens Institute of Technology, Hoboken, NJ07030.
Hilders Oswaldo
Affiliation:
Centro de Biornateriales, Facultad de Ingenieria, Universidad Central de Venezuela, Apartado Postal 47711, Los Chaguaramos, 1041Caracas Venezuela.
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Extract

Creep process in dental amalgams has been a subject of study. The performance of dental amalgams depends on the creep resistance of different products offered in the market. Creep process occurs at mouth temperatures which are slightly lower than Gamma 1 matrix phase (Ag2Hg3) melting point (310°K). One successful attempt to improve the creep resistance has been the addition of a dispersed phase (particles of eutectic Ag-Cu phase) in conventional amalgams. By this method, a new phase (η- Cu6Sn5) has been produced which inhibits the detrimental gamma 2 (Sn8Hg) formation. It has been proposed that the presence of finely distributed particles of η-Cu6Sn5 in the matrix lowers the creep rate. This behavior has been attributed to the pinning effect of these fine particles on the dislocations produced during the creep process (1). The presence of η-Cu6Sn5 phase finely dispersed in the matrix has been explained by the initial formation of reaction rings around the eutectic Ag-Cu spherical particles.

Type
Diffraction Techniques
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 958 - 959
Copyright
Copyright © Microscopy Society of America

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References

References:

(1)Vrijhoef, M., et al, Annual Meet. Int. Ass. Dent. Res., Abstr., N° 226, pp. 111. 1972Google Scholar
(2)Dickson, G., et al, J. Resarch, Ntl. Bur. Stand. C. Eng. Instruments, vol 7, pp 215–218, 1968.CrossRefGoogle Scholar
(3)Caballero, R., and Quintero, A., Jorn., Investig. Fac. Ingenieria, JIFI98, Universidad Central de Venezuela, 1998.Google Scholar