This report provides analysis data on black deposits observed on gold-plated test socket pads. The socket pads are an integral part of a burn-in test where the test simulates an accelerated aging process and is routinely performed on new products. The test consists of placing a device, as shown in Figure 1, with lead/tin plated copper leads in a test socket then placing that assembly into a “burn-in” oven set to a specific elevated temperature, 150° C in this case, for a specific time. Typically, a bias voltage is applied through the pads on the socket during the test. Historically, during extended burn-in tests of Quad Flat Pack (QFP) devices, problems arose when several devices unexpectedly exhibited open socket-to-device contacts. The “opens” problem repeated itself when new QFP devices were installed in the sockets . Upon visual inspection of the sockets, black deposits were observed in the contact regions, as shown in Figure 2.