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Continuum Damage Approach for Fatigue Life Prediction of Viscoplastic Solder Joints

Published online by Cambridge University Press:  10 April 2015

L. Benabou ,
Z. Sun ,
P. Pougnet  and
P. R. Dahoo
L. Benabou*
Affiliation:
LISV Université de Versailles Saint Quentin-en-Yvelines Versailles, France
Z. Sun
Affiliation:
LASMIS Université de Technologie de Troyes Troyes, France
P. Pougnet
Affiliation:
VALEO Powertrain Systems Cergy Pontoise, France
P. R. Dahoo
Affiliation:
LATMOS Université de Versailles Saint Quentin-en-Yvelines Versailles, France
*
* Corresponding author ([email protected])
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Abstract

The accurate and effective prediction of the failure for an inelastic structure, such as a solder joint in an electronic chip packaging, remains a current issue. Subjected to sub-critical cyclic loading, the solder can undergo fatigue cracks, leading to the failure of the whole system after a certain number of power cycles. In this paper, a model for describing the viscoplastic behavior of the solder material under power cycling is implemented in the finite element code Abaqus and a continuum damage procedure is used for lifetime prediction. Damage initiation criterion and damage evolution law, based both on the inelastic strain energy per stabilized cycle as proposed by Darveaux, are used in conjunction with the direct cyclic procedure available in Abaqus. This latter technique allows reducing the considerable computation time needed to obtain the stabilized states during the repetitive loading cycles.

Keywords

Continuum damage approachLow-cycle fatigueCreep behaviorFinite element analysis
Type
Research Article
Information
Journal of Mechanics , Volume 31 , Issue 5 , October 2015 , pp. 525 - 531
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2015 

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