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The micro-impact fracture behavior of lead-free solder ball joints

Published online by Cambridge University Press:  31 January 2011

Y.L. Huang ,
K.L. Lin  and
D.S. Liu
Y.L. Huang*
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 70101, Republic of China
K.L. Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 70101, Republic of China
D.S. Liu
Affiliation:
Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan 621, Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn–1Ag–0.1Cu–0.02Ni–0.05In, Sn–1.2Ag–0.5Cu–0.05Ni, and Sn–1Ag–0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.

Keywords

FracturePackagingStress/strain relationship
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 4 , April 2008 , pp. 1057 - 1063
Copyright
Copyright © Materials Research Society 2008

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References

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