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Mechanical Stress, Grain-boundary Relaxation, and Oxidation of Sputtered CuNi(Mn) Films

Published online by Cambridge University Press:  31 January 2011

W. Brückner ,
W. Pitschke ,
S. Baunack  and
J. Thomas
W. Brückner
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
W. Pitschke
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
S. Baunack
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
J. Thomas
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
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Abstract

This paper focuses on understanding stress development in CuNi42Mn1 thin films during annealing in Ar. In addition to stress-temperature measurements, resistance-temperature investigations and chemical and microstructural characterization by Auger electron spectroscopy, scanning and transmission electron microscopy, x-ray diffraction, and atomic force microscopy were also carried out. The films are polycrystalline with a grain size of 20 nm up to 450 °C. To explain the stress evolution above 120 °C, atomic rearrangement (excess-vacancy annihilation, grain-boundary relaxation, and shrinkage of grain-boundary voids) and oxidation were considered. Grain-boundary relaxation was found to be the dominating process up to 250–300 °C. A sharp transition from compressive to tensile stress between 300 and 380 °C is explained by the formation of a NiO surface layer due to reaction with the remaining oxygen in the Ar atmosphere. This oxidation is masking the inherent structural relaxation above 300 °C.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 4 , April 1999 , pp. 1286 - 1294
Copyright
Copyright © Materials Research Society 1999

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References

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