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Grinding force and microcrack density in abrasive machining of silicon nitride

Published online by Cambridge University Press:  03 March 2011

Hockin H.K. Xu ,
Lanhua Wei  and
Said Jahanmir
Hockin H.K. Xu*
Affiliation:
Ceramics Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Lanhua Wei*
Affiliation:
Ceramics Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Said Jahanmir
Affiliation:
Ceramics Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
*
a)Guest Scientist, from School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332-0405.
b)Guest Scientist, from Department of Physics and Astronomy, Wayne State University, Detroit, Michigan 48201.
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Abstract

The relationship between grinding forces and the material's resistance to microfracture is investigated in abrasive machining of silicon nitride ceramics. Surface grinding is performed on two forms of silicon nitride with different microstructures, and the grinding forces are measured. In addition, single-point scratching is performed on polished surfaces to amplify the damage associated with the action of an individual abrasive particle in grinding. A thermal wave measurement technique is then used on the cross sections to characterize the density of subsurface microcracks associated with scratching. Compared to a fine-grain silicon nitride, the density of microcracks in a course-grain silicon nitride is significantly larger, while the grinding force is smaller. The smaller grinding force for the coarse-grain silicon nitride is attributed to the ease of local intergranular microfracture and grain dislodgement during grinding.

Type
Articles
Information
Journal of Materials Research , Volume 10 , Issue 12 , December 1995 , pp. 3204 - 3209
Copyright
Copyright © Materials Research Society 1995

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References

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