Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-27T04:46:14.807Z Has data issue: false hasContentIssue false
  • English
  • Français

Elastic modulus measurement of multilayer metallic thin films

Published online by Cambridge University Press:  31 January 2011

Ki-Hyun Cho  and
Youngman Kim
Ki-Hyun Cho
Affiliation:
Department of Metallurgical Engineering, Chonnam National University, Kwangju, Korea 500–757
Youngman Kim
Affiliation:
Department of Metallurgical Engineering, Chonnam National University, Kwangju, Korea 500–757
Get access

Abstract

Two- and three-layer composite models were developed using a beam vibration theory, and the models were applied for measuring Young's moduli of thin metallic films. The Cr, Ni, and Co-coated Si wafer composites (two-layer composite) and (Cr/Ti/Si) composites (three-layer composite) were produced by radio-frequency (rf) magnetron sputtering and used to test the developed models. Young's moduli of (Cr) films obtained by the three-layer composite model agree well with those of (Cr) films obtained by the two-layer composite model, considering (Ti/Si) as the one layer and (Cr) as the other layer. This suggests that moduli of multilayer films may be obtained by using a two-layer composite model repeatedly.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 5 , May 1999 , pp. 1996 - 2001
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Hu, S. M., J. Appl. Phys. 70 (6), 15 (1991).Google Scholar
2.Thin Films: Stresses and Mechanical Properties II, edited by Doerner, M. F., Oliver, W.C., Pharr, G. M., and Brotzen, F. R. (Materials Research Society, Pittsburgh, PA, 1990).Google Scholar
3.Kim, Y., J. Electron Mater. 26, 1002–1008 (1997).CrossRefGoogle Scholar
4.Kim, Y. and Cho, K-H., J. Korea Institute of Metals and Materials 35 (11), 468 (1997).Google Scholar
5.Volterra, E. and Zachmanoglou, E. C., Dynamics of Vibrations (Merrill, Columbus, OH, 1965), p. 321.Google Scholar
6.Clark, S.K., Dynamics of Continuous Elements (Prentice Hall, Englewood Cliffs, NJ, 1972), p. 75.Google Scholar
7.Case, E.D. and Kim, Y., J. Mater. Sci. 28, 1885 (1993).CrossRefGoogle Scholar
8.Timoshenko, S.P. and Young, D. H., Strength of Materials, 4th ed. (Van Nostrand Reinhold, New York, 1962), p. 113.Google Scholar
9.Kern, W., Handbook of Semiconductor Wafer Cleaning Technology; Science, Technology, and Applications (Noyes Publications, Park Ridge, NJ, 1993), p. 17.Google Scholar
10.Spinner, S. and Tefft, W.E., ASTM Proc. 61, 1221 (1961).Google Scholar
11.Schreiber, E., Anderson, O. L., and Soga, N., Elastic Constants and Their Measurements (McGraw-Hill, New York, 1974), Chap. 4.Google Scholar
12.Forster, F., Z. Metallk. 29, 109 (1937).Google Scholar
13.Pickett, G., ASTM Proc. 45, 846 (1945).Google Scholar
14.Hasselman, D.P. H., Tables for computation of shear modulus and Young's modulus of elasticity from resonant frequencies of rectangular prisms, Carborundum Co., Niagara Falls, NY (1961).Google Scholar
15.Kalpakjian, S., Fundamentals of Deformation Processing (Syracuse Univ. Press, 1964), p. 88.Google Scholar
16.Smith, W.F., Principles of Materials Science and Engineering (McGraw-Hill Book Company, New York, 1986), p. 251.Google Scholar
17.Dutcher, J. R., Lee, S., England, D.D., Stegeman, G.L., and Falco, C. M., Mater. Sci. Eng. A126, 13 (1990).CrossRefGoogle Scholar
18.Rouzaud, A., Barbier, E., Ernoult, J., and Quesnel, E., Thin Solid Films 270, 270 (1995).CrossRefGoogle Scholar
19.Adams, D.P., Parfitt, L. J., Bilello, J. C., Yalisove, S. M., and Rek, Z. U., Thin Solid Films, 266, 52 (1995).CrossRefGoogle Scholar