Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-29T15:11:11.801Z Has data issue: false hasContentIssue false
  • English
  • Français

The effects of natural convection and conduction in a zone-melting-recrystallization chamber

Published online by Cambridge University Press:  31 January 2011

Bradley D. Heilman ,
Matthew A. Marston ,
Peter Y. Wong  and
Ioannis N. Miaoulis
Bradley D. Heilman
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, Massachusetts 02155
Matthew A. Marston
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, Massachusetts 02155
Peter Y. Wong
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, Massachusetts 02155
Ioannis N. Miaoulis
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, Massachusetts 02155
Get access

Abstract

Zone-melting recrystallization (ZMR) with a graphite strip heater is used to improve the material quality of thin film structures for microelectronic applications. The process takes place in a sealed chamber filled with an inert gas such as argon or helium. The effect of natural convection and conduction at the interface between the gas and film structure was studied both numerically and experimentally. Numerical simulations of the temperature profile in the film structure, and the flow pattern and temperature field in the gas were developed. Experimental observations in a scaled setup using a liquid medium verified the flow patterns calculated from the numerical model of the gas flow in the chamber. Results indicated that the gas is stagnant in the region below the strip heater; consequently, conduction from the strip heater to the wafer is prevalent. Outside the stagnant region, natural convection cools the film structure. These two effects combine to create a steeper thermal gradient across the entire wafer which can increase the thermal stresses in the film. The magnitude of this thermal gradient depends strongly on the thermal diffusivity of the gas. The configuration of the strip heater may significantly affect the amount of heat conduction in the stagnant region.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 3 , March 1993 , pp. 551 - 557
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Miaoulis, I.N., Wong, P.Y., Lipman, J.D., and Im, J.S., J. Appl. Phys. 69, 10 (1991).Google Scholar
2Brodowicz, K. and Kierkus, W. T., Int. J. Heat Mass Transfer 9, 81 (1966).CrossRefGoogle Scholar
3Torrance, K.E., Orloff, L., and Rockett, J.A., J. Fluid Mech. 36, 1 (1969).Google Scholar
4Takeuchi, M., Heya, N., and Kimura, T., Trans. Jpn. Soc. Mech. Engrs., Ser. B 52, 474, 886 (1986).CrossRefGoogle Scholar
5Im, J.S., Lipman, J.D., Miaoulis, I.N., Chen, C.K., and Thompson, C.V., in Beam-Solid Interactions: Physical Phenomena, edited by Knapp, J. A., Borgesen, P., and Zuhr, R. A. (Mater. Res. Soc. Symp. Proc. 157, Pittsburgh, PA, 1990), p. 455.Google Scholar
6Ludwig, J. C. and Spalding, D. B., The PHOENICS Reference Manual (CHAM Limited, 1990).Google Scholar
7Spalding, D. B., The PHOENICS Beginners Guide (CHAM Limited, 1990).Google Scholar
8Incropera, F. P. and DeWitt, D. P., Introduction to Heat Transfer, 2nd ed. (John Wiley and Sons, New York, 1990), pp. 317, 370.Google Scholar
9Holman, J.P., Heat Transfer, 6th ed. (McGraw-Hill Publishing Company, New York, 1986), p. 281.Google Scholar
10Cline, H. E., J. Appl. Phys. 54, 5 (1983).Google Scholar
11Lipman, J.D., Wong, P.Y., Miaoulis, I.N., and Im, J.S., Am. Soc. Mech. Eng. HTD-123, 211 (1989).Google Scholar