Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-20T00:47:30.262Z Has data issue: false hasContentIssue false
  • English
  • Français

Controlling the shape of Al/Ni multilayer foils using variations in stress

Published online by Cambridge University Press:  31 January 2011

Robert Knepper ,
Gregory Fritz  and
Timothy P. Weihs
Robert Knepper
Affiliation:
Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218
Gregory Fritz
Affiliation:
Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218
Timothy P. Weihs*
Affiliation:
Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Al/Ni multilayer foils were sputter-deposited with an in-plane residual stress state that was altered midway through the thickness of the foils by changing the bilayer spacing. The difference in stress between the top and bottom halves of the foil caused these systems to curl when they were removed from their substrates. As predicted, the radius of curvature increased linearly as the difference in stress between the upper and lower halves decreased and as foil thickness increased, demonstrating the ability to fabricate layered foils with specific curvatures. Unexpectedly, however, the radii of curvature of all the free-standing foils decreased with time after removal from their substrates, suggesting that a time-dependent relaxation mechanism was operating. An explanation based on stress driven, time-dependent deformation is offered to explain the relaxation, and an elasticity-based curvature model is presented for comparison with the measured steady state curvatures.

Keywords

Elastic propertiesEnergetic materialThin film
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 7 , July 2008 , pp. 2009 - 2016
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Floro, J.A.: Propagation of explosive crystallization in thin Rh–Si multilayer films. J. Vac. Sci. Technol., A 4, 631 1986CrossRefGoogle Scholar
2Gavens, A.J., Van Heerden, D., Mann, A.B., Reiss, M.E.Weihs, T.P.: Effect of intermixing on self-propagating exothermic reactions in Al/Ni nanolaminate foils. J. Appl. Phys. 87, 1255 2000CrossRefGoogle Scholar
3Besnoin, E., Cerutti, S.Knio, O.M.: Effect of reactant and product melting on self-propagating reactions in multilayer foils. J. Appl. Phys. 92, 5474 2002CrossRefGoogle Scholar
4Wang, J., Besnoin, E., Duckham, A., Spey, S.J., Reiss, M.E., Knio, O.M.Weihs, T.P.: Joining of stainless-steel specimens with nanostructured Al/Ni foils. J. Appl. Phys. 95, 248 2004CrossRefGoogle Scholar
5Ma, E., Thompson, C.V., Clevenger, L.A.Tu, K.N.: Self-propagating explosive reactions in Al/Ni multilayer thin films. Appl. Phys. Lett. 57, 1262 1990CrossRefGoogle Scholar
6Kelly, P.J., Tinston, S.F.Arnell, R.D.: The deposition and analysis of pyrotechnic devices deposited by magnetron sputtering. Surf. Coat. Technol. 60, 597 1993CrossRefGoogle Scholar
7Kelly, P.J.Tinston, S.F.: Pyrotechnic devices by unbalanced magnetron sputtering. Vacuum 45, 507 1994CrossRefGoogle Scholar
8Swiston, A.J. Jr., Hufnagel, T.C.Weihs, T.P.: Joining bulk metallic glass using reactive multilayer foils. Scr. Mater. 48, 1575 2003CrossRefGoogle Scholar
9Wang, J., Besnoin, E., Duckham, A., Spey, S.J., Reiss, M.E., Knio, O.M., Powers, M., Whitener, M.Weihs, T.P.: Room-temperature soldering with nanostructured foils. Appl. Phys. Lett. 83, 3987 2003CrossRefGoogle Scholar
10Duckham, A., Spey, S.J., Wang, J., Reiss, M.E., Weihs, T.P., Besnoin, E.Knio, O.M.: Reactive nanostructured foil used as a heat source for joining titanium. J. Appl. Phys. 96, 2336 2004CrossRefGoogle Scholar
11Harper, B.D.Wu, C.P.: A geometrically nonlinear model for predicting the intrinsic film stress by the bending-plate method. Int. J. Sol. Struct. 25, 511 1990CrossRefGoogle Scholar
12Fahnline, D.E., Masters, C.B.Salamon, N.J.: Thin film stress from nonspherical substrate bending measurements. J. Vac. Sci. Technol., A 9, 2483 1991CrossRefGoogle Scholar
13Mann, A.B., Tapson, J., van Heerden, D., Lewis, A.C., Josell, D.Weihs, T.P.: Apparatus to measure wafer curvature for multilayer systems in a vacuum furnace. Rev. Sci. Instrum. 73, 1821 2002CrossRefGoogle Scholar
14Stoney, G.G.: The tension of metallic films deposited by electrolysis. Proc. R. Soc. London Ser. A 82, 172 1909Google Scholar
15Abermann, R.: Measurements of the intrinsic stress in thin metal films. Vacuum 41, 1279 1990CrossRefGoogle Scholar
16Nix, W.D.Clemens, B.M.: Crystallite coalescence: A mechanism for intrinsic tensile stress in thin films. J. Mater. Res. 14, 3467 1999CrossRefGoogle Scholar
17Floro, J.A., Chason, E., Cammarata, R.C.Srolovitz, D.J.: Physical origins of intrinsic stresses in Volmer–Weber thin films. MRS Bull. 27, 19 2002CrossRefGoogle Scholar
18Hoffman, D.W.Thornton, J.A.: Internal stresses in Cr, Mo, Ta, and Pt films deposited by sputtering from a planar magnetron source. J. Vac. Sci. Technol. 20, 355 1982CrossRefGoogle Scholar
19Cammarata, R.C.: Surface and interface stress effects in thin films. Prog. Surf. Sci. 46, 1 1994CrossRefGoogle Scholar
20Berger, S.Spaepen, F.: The Ag/Cu interface stress. Nanostruct. Mater. 6, 201 1995CrossRefGoogle Scholar
21Ruud, J.A., Witvrouw, A.Spaepen, F.: Bulk and interface stresses in silver-nickel multilayered thin films. J. Appl. Phys. 74, 2517 1993CrossRefGoogle Scholar
22Shull, A.L.Spaepen, F.: Measurements of stress during vapor deposition of copper and silver thin films and multilayers. J. Appl. Phys. 80, 6243 1996CrossRefGoogle Scholar
23Misra, A., Kung, H., Mitchell, T.E.Nastasi, M.: Residual stresses in polycrystalline Cu/Cr multilayered thin films. J. Mater. Res. 15, 756 2000CrossRefGoogle Scholar
24Zhang, X.Misra, A.: Residual stresses in sputter-deposited copper/330 stainless steel multilayers. J. Appl. Phys. 96, 7173 2004CrossRefGoogle Scholar
25Clemens, B.M., Nix, W.D.Ramaswamy, V.: Surface-energy-driven intermixing and its effect on the measurement of interface stress. J. Appl. Phys. 87, 2816 2000CrossRefGoogle Scholar
26Nathani, H., Wang, J.Weihs, T.P.: Long-term stability of nanostructured systems with negative heats of mixing. J. Appl. Phys. 101, 104315 2007CrossRefGoogle Scholar
27Venkatraman, R.Bravman, J.C.: Separation of film thickness and grain-boundary strengthening effects in Al thin-films on Si. J. Mater. Res. 7, 2040 1992CrossRefGoogle Scholar
28Clemens, B.M.Bain, J.A.: Stress determination in textured thin-films using x-ray diffraction. MRS Bull. 17, 46 1992CrossRefGoogle Scholar
29Cornella, G., Lee, S.H., Nix, W.D.Bravman, J.C.: An analysis technique for extraction of thin film stresses from x-ray data. Appl. Phys. Lett. 71, 2949 1997CrossRefGoogle Scholar
30Freund, L.B.Suresh, S.: Thin Film Materials: Stress, Defect Formation and Surface Evolution Cambridge University Press Cambridge, England 2003Google Scholar
31Doerner, M.F.Brennan, S.: Strain distribution in thin aluminum films using x-ray depth profiling. J. Appl. Phys. 63, 126 1988CrossRefGoogle Scholar