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Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging

Published online by Cambridge University Press:  27 June 2011

Zhongbing Luo ,
Lai Wang ,
Qinqin Fu ,
Chongqian Cheng  and
Jie Zhao
Zhongbing Luo
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Lai Wang
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Qinqin Fu
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Chongqian Cheng
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Jie Zhao*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints at different aging temperatures was studied using x-ray diffraction (XRD). The time-temperature-formation curve was obtained and is discussed based on the phase transformation from existing η-Cu6Sn5 and interfacial reaction at temperatures below 186 °C. A minimum formation time was observed in the temperature range of 135–150 °C.

Keywords

SolderingCompoundPhase transformation
Type
Materials Communications
Information
Journal of Materials Research , Volume 26 , Issue 12 , 28 June 2011 , pp. 1468 - 1471
Copyright
Copyright © Materials Research Society 2011

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References

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