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Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints

Published online by Cambridge University Press:  31 January 2011

Y.K. Jee ,
Jin Yu  and
Y.H. Ko
Y.K. Jee*
Affiliation:
Department of Material Science and Engineering, Korea Advanced Institute of Science and Engineering, Yuseong-gu, Daejeon 305-701, Korea
Jin Yu
Affiliation:
Department of Material Science and Engineering, Korea Advanced Institute of Science and Engineering, Yuseong-gu, Daejeon 305-701, Korea
Y.H. Ko
Affiliation:
Samsung Electronics, Hwasung-city, Gyeongii-do 445-701, Korea
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Varying amounts of Zn (1, 3, 7 wt%) were added to Sn–3.5Ag solder on the electroless Ni(P)/immersion Au metallization, and solder joint microstructures after reflow and isothermal aging (500 h at 150 °C) were investigated using scanning electron microscopy, energy dispersive x-ray spectroscopy, transmission electron microscopy, and x-ray diffraction, which were subsequently correlated to the microhardness and drop test results. Zinc in the solder affected the solder joint intermetallic compounds profoundly, which improved the drop reliability significantly. The effect of Zn was to nucleate Ni5Zn21 and to suppress the formation of Ni3P, Ni3SnP, and Ni3Sn4, which were known to increase the propensity for brittle cracking. Drop test results showed an inverse correlation between the number of drops-to-failure (Nf) and the thickness of Ni3P layer. As the growth of the Ni3P layer was suppressed by Zn, drop reliability increased substantially.

Keywords

Chemical reactionFractureMicrostructure
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 10 , October 2007 , pp. 2776 - 2784
Copyright
Copyright © Materials Research Society 2007

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References

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