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Analysis of local grain boundary strengthening utilizing the extrinsic indentation size effect

Published online by Cambridge University Press:  14 May 2019

Prasad Pramod Soman
Affiliation:
Department of Materials Science and Engineering, Michigan Technological University, Houghton, Michigan 49931, USA
Erik G. Herbert
Affiliation:
Department of Materials Science and Engineering, Michigan Technological University, Houghton, Michigan 49931, USA
Katerina E. Aifantis*
Affiliation:
Mechanical and Aerospace Engineering, University of Florida, Gainesville, Florida 32612, USA
Stephen A. Hackney*
Affiliation:
Department of Materials Science and Engineering, Michigan Technological University, Houghton, Michigan 49931, USA
*
a)Address all correspondence to these authors. e-mail: [email protected]
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Abstract

The extrinsic indentation size effect (ISE) is utilized to analyze the depth-dependent hardness for Berkovich indentation of non-uniform dislocation distributions with one and two dimensional deformation gradients and is then extended to indentation results at grain boundaries. The role of the Berkovich pyramid orientation and placement relative to the grain boundary on extrinsic ISE is considered in terms of slip transmission at yield and plastic incompatibility during post-yield deformation. The results are interpreted using a local dislocation hardening mechanism originally proposed by Ashby, combined with the Hall–Petch equation. The Hall–Petch coefficient determined from the extrinsic ISE of the grain boundary is found to be consistent with the published values for pure Fe and mild steel. A simple, linear continuum strain gradient plasticity model is used to further analyze the results to include contributions from a non-uniform distribution in plastic strain and dislocation density.

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Article
Copyright
Copyright © Materials Research Society 2019 

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Footnotes

c)

This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/editor-manuscripts/.

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