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The 45° grain boundaries in YBa2Cu3O7−δ

Published online by Cambridge University Press:  31 January 2011

Stuart McKernan ,
M. Grant Norton  and
C. Barry Carter
Stuart McKernan*
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
M. Grant Norton*
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
C. Barry Carter*
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
*
a)Present address: Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455.
b)Present address: Department of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164.
a)Present address: Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455.
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Abstract

High-angle grain boundaries in YBa2Cu3O7−δ thin films are of technological interest because of the weak coupling observed between the grains; however, not all high-angle grain boundaries show this weak-link behavior. The microstructure of both these boundaries is not understood, nor is the reason for the differing electrical transport properties. High-angle grain boundaries in YBa2Cu3O7−δ thin films on MgO, where the angular misorientation between the grains is ∼45°, have been examined using high-resolution electron microscopy. The results show that the boundary structure can appear quite different even when the angular misorientation between the two grains is the same. The stability of the grain boundaries under the electron irradiation in the electron microscope was found to be a function of the accelerating voltage—400 kV leads to rapid disordering of the boundary region.

Type
Articles
Information
Journal of Materials Research , Volume 7 , Issue 5 , May 1992 , pp. 1052 - 1059
Copyright
Copyright © Materials Research Society 1992

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References

1.Tietz, L. A., Carter, C. B., Lathrop, D. K., Russek, S. E., Buhrman, R. A., and Michael, J. R., J. Mater. Res. 4, 1072 (1989).CrossRefGoogle Scholar
2.Norton, M. G. and Carter, C. B., J. Cryst. Growth 110, 645 (1991).CrossRefGoogle Scholar
3.Ramesh, R., Hwang, D., Ravi, T. S., Inam, A., Barner, J. B., Nazar, L., Chan, S-W., Chen, C. Y., Dutta, B., Venkatesan, T., and Wu, X. D., Appl. Phys. Lett. 56, 2243 (1990).CrossRefGoogle Scholar
4.Norton, M. G., Tietz, L. A., Summerfelt, S. R., and Carter, C. B., Appl. Phys. Lett. 55, 2348 (1989).CrossRefGoogle Scholar
5.Norton, M. G. and Carter, C. B., in Laser Ablation for Materials Synthesis, edited by Paine, D. C. and Bravman, J. C. (Mater. Res. Soc. Symp. Proc. 191, Pittsburgh, PA, 1990), p. 165.Google Scholar
6.Tietz, L. A., Carter, C. B., Lathrop, D. K., Russek, S. E., and Buhrman, R. A., in High-Temperature Superconductors, edited by Brodsky, M. B., Dynes, R. C., Kitazawa, K., and Tuller, H. L. (Mater. Res. Soc. Symp. Proc. 99, Pittsburgh, PA, 1988), p. 715.Google Scholar
7.Norton, M. G., Tietz, L. A., Carter, C. B., Russek, S. E., Moeckly, B. H., and Buhrman, R. A., in High-Temperature Superconductors: Fundamental Properties and Novel Materials Processing, edited by Christen, D., Narayan, J., and Schneemeyer, L. (Mater. Res. Soc. Symp. Proc. 169, Pittsburgh, PA, 1990), p. 513.Google Scholar
8.Tietz, L. A., Ph.D. Thesis, Cornell University (1991).Google Scholar
9.Hwang, D. M., Ravi, T. S., Ramesh, R., Chan, S.-W., Chen, C. Y., Nazar, L., Wu, X., Inam, A., and Venkatesan, T., Appl. Phys. Lett. 57, 1690 (1990).CrossRefGoogle Scholar
10.Dimos, D., Chaudari, P., Mannhart, J., and LeGoues, F. K., Phys. Rev. Lett. 61, 219 (1988).CrossRefGoogle Scholar
11.Dimos, D., Chaudhari, P., and Mannhart, J., Phys. Rev. B 41, 4038 (1990).CrossRefGoogle Scholar
12.Babcock, S. E., Cai, X. Y., Kaiser, D. L., and Larbalestier, D. C., Nature 347, 167 (1990).CrossRefGoogle Scholar
13.Chan, S-W., Hwang, D. M., Ramesh, R., Sampere, S. M., Nazar, L., Gerhardt, R., and Pruna, P., in High Tc Superconducting Thin-Films: Processing, Characterization and Applications, edited by Stockbaur, R., AIP Conf. Proc. 200, 172 (1990).CrossRefGoogle Scholar
14.Babcock, S. E. and Larbalestier, D. C., J. Mater. Res. 5, 919 (1990).CrossRefGoogle Scholar
15.Lathrop, D. K., Moeckly, B. H., Russek, S. E., and Buhrman, R. A., Appl. Phys. Lett. 58, 1095 (1991).CrossRefGoogle Scholar
16.Moeckly, B. H., Russek, S. E., Lathrop, D. K., Buhrman, R. A., Li, J., and Mayer, J. W., Appl. Phys. Lett. 57, 1687 (1990).CrossRefGoogle Scholar
17.Moeckly, B. H., Lathrop, D. K., Russek, S. E., Buhrman, R. A., Norton, M. G., and Carter, C. B., IEEE Trans. Magn. 27 (1991, in press).CrossRefGoogle Scholar
18.Kouh-Simpson, Y., Carter, C. B., Morrissey, K. J., Angelini, P., and Bentley, J., J. Mater. Sci. 21, 2689 (1986).CrossRefGoogle Scholar
19.Sarikaya, M., Thiel, B. L., LAksay, A., Weber, W. J., and Frydrych, W. S., J. Mater. Res. 2, 736 (1987).CrossRefGoogle Scholar
20.Rickards, J., Oliver, A., and Yacamán, M. J., Ultramicroscopy 30, 425 (1989).CrossRefGoogle Scholar
21.Basu, S. N., Roy, T., Mitchell, T. E., and Nastasi, M., in Beam-Solid Interactions: Physical Phenomena, edited by Knapp, J. A., Borgesen, P., and Zuhr, R. A. (Mater. Res. Soc. Symp. Proc. 157, Pittsburgh, PA, 1990).Google Scholar
22.Roy, T., Sickafus, K., Clinard, F. W., and Mitchell, T. E., Proc. 47th Annual Meeting of the Electron Microsc. Soc. of Am., edited by Bailey, G. W., 184 (1989).CrossRefGoogle Scholar
23.Russek, S. E., Moeckly, B. H., Buhrman, R. A., McWhirter, J. T., Sievers, A. J., Norton, M. G., Tietz, L. A., and Carter, C. B., in High-Temperature Superconductors: Fundamental Properties and Novel Materials Processing, edited by Christen, D., Narayan, J., and Schneemeyer, L. (Mater. Res. Soc. Symp. Proc. 169, Pittsburgh, PA, 1990), p. 455.Google Scholar
24.Cava, R. J., Batlogg, B., Van, R. B. Dover, Murphy, D. W., Sunshine, S., Siegrist, T., Remeika, J. P., Reitman, E. A., Zahurak, S., and Espinosa, G. P., Phys. Rev. Lett. 58, 1676 (1987).CrossRefGoogle Scholar
25. For example, papers read in Symposium P: Interfaces in High Temperature Superconducting Systems, Mater. Res. Soc. Spring Meeting, Anaheim, CA (1991).Google Scholar
26.Suenaga, M., Welch, D. O., Xu, Y., Zhu, Y., Ghosh, A. K., and Moodenbaugh, A. R., in Proc. 3rd Annual Conf. Superconductivity and Applications, edited by Kwok, H. S., Kao, Y-H., and Shaw, D. T., 27 (1989).CrossRefGoogle Scholar
27.Hylton, T. L. and Beasley, M. R., Phys. Rev. B 41, 11669 (1990).CrossRefGoogle Scholar