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Residual Stresses and Differential Deformation of Electroplated Structures

Published online by Cambridge University Press:  06 March 2019

G. Sheikh  and
I. C. Noyan
G. Sheikh
Affiliation:
Dept. of Metallurgical Engineering, Henry Krumb School of Mines, Columbia University New York, NY Thomas J. Watson Research Center IBM Research Division Yorktown Heights, NY
I. C. Noyan
Affiliation:
Dept. of Metallurgical Engineering, Henry Krumb School of Mines, Columbia University New York, NY Thomas J. Watson Research Center IBM Research Division Yorktown Heights, NY
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Abstract

We report the results of a recent study where nickel substrates electroplated with chromium were loaded in-situ on an x-ray diffractometer. This technique allows determination of lattice spacings in the vicinity of the interface for both the film and the substrate as a function of the applied load. We used such lattice parameter data, SEM observations of the surface and x-ray peak breadth data to study the partitioning of deformation between the film and the substrate. The data indicates progressive loss of adhesion between the film and the substrate with increasing deformation. We observe significant effect of electroplating residual stresses on the mechanical behavior of the system. The loss of adhesion between the film and the substrate coupled with the initial residual stress profile causes an apparent 'negative Poisson's ratio' for the film during initial stages of the loading. This effect disappears with cyclic loading and unloading.

Type
Research Article
Information
Advances in X-Ray Analysis , Volume 33: Thirty-Eighth Annual Conference on Applications of X-ray Analysis, July 31 - August 4, 1989 , 1989 , pp. 161 - 169
Copyright
Copyright © International Centre for Diffraction Data 1989

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