Al–(12, 20, 35 wt%)Si alloys were fabricated using powder metallurgy process involving hot pressing followed by hot extrusion. The effect of Si content on the microstructure [by scanning electron microscopy], the mechanical properties (hardness and tensile tests), and the thermal expansion behavior were studied in detail, respectively. Due to the friction between the Si phase and the matrix, as well as the diffusion of the Si atoms, the Si phase becomes a particulate shape after hot extrusion, and the size increases with increasing Si content. The mechanical strength increases, whereas, the elongation decreases with increasing the Si content from 12 to 35 wt%, which lead to a variation of the fracture mechanism from ductile to brittle failure. The coefficient of thermal expansion (CTE) decreases with increasing Si content as a result of restriction of Si on the Al matrix, and the measured CTE value is in good agreement with the Turner model below 573 K.

The paradox of strength and ductility is now well established and denotes the difficulty of simultaneously achieving both high strength and high ductility. This paradox was critically examined using a cast Al–7%Si alloy processed by high-pressure torsion (HPT) for up to 10 turns at a temperature of either 298 or 445 K. This processing reduces the grain size to a minimum of ∼0.4 μm and also decreases the average size of the Si particles. The results show that samples processed to high numbers of HPT turns exhibit both high strength and high ductility when tested at relatively low strain rates and the strain rate sensitivity under these conditions is ∼0.14 which suggests that flow occurs by some limited grain boundary sliding and crystallographic slip. The results are also displayed on the traditional diagram for strength and ductility and they demonstrate the potential for achieving high strength and high ductility by increasing the number of turns in HPT.

An experimental high-resolution image of a solid–liquid interface of solid Si and liquid Al–Si alloy has been compared with theoretical images obtained by computer simulation. It has been concluded that the solid–liquid interface has a transition layer, the structure of which is compatible with the 1 × 1 Si-{111} surface.