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Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn95.5Ag3.8Cu0.7 solder joints
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- Journal:
- Journal of Materials Research / Volume 16 / Issue 10 / October 2001
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2914-2921
- Print publication:
- October 2001
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- Article
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