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Soi by CVD: An Overview of Material Aspects and Implications of Device Properties

Published online by Cambridge University Press:  22 February 2011

L. Jastrzebski
Affiliation:
RCA Laboratories, Princeton, NJ 08540
A. G. Kokkas
Affiliation:
RCA Laboratories, Princeton, NJ 08540
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Abstract

Two CVD techniques producing monocrystalline SOI films, silicon-on sapphire (SOS) and Epitaxial Lateral Overgrowth (ELO), are described and the nature of the crystallographic defects in the films is discussed. The geometrical structure of SOI devices, device properties, dynamic characteristics, capacitance, and radiation hardness are then examined with emphasis on evaluating the potential of SOI technologies in future applications.

Type
Research Article
Copyright
Copyright © Materials Research Society 1984

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References

REFERENCES

1. e.g., Kamins, T., IEEE Electron Dev. Lett. EDL–3, 341 (1982);Google Scholar
1aMiyao, M., Ohikura, M., Takemoto, I., Tamura, K., Tokuyama, T., Appl. Phys. Lett. 41, 59 (1932).Google Scholar
2. For recent review see Celler, G., J. Crystal Growth, December issue (1983), in press.Google Scholar
3. e.g., Tsaur, B. Y., Fan, J. C. C., Geis, M. W., Silversmith, D. J., and Mountain, R. W., 1981 IEDM Tech. Digest, p.232;Google Scholar
3a for review see same authors, J. Crystal Growth, Dec. issue (1983), in press.Google Scholar
4. For most recent review see Smith, H., J. Crystal Growth, Dec. (1983), in press.Google Scholar
5.Watanabe, M. and Taoi, A., Japan. J. Appl. Phys. 5, 737 (1966);Google Scholar
5aDylewski, J. and Joski, H. L., Thin Solid Films 37, 241 (1976);Google Scholar
5bIrita, Y., Kunii, Y., Takahashi, M. and Kajiyama, K., Japan. J. Appl. Phys. 20, L909 (1981).Google Scholar
6.Konaka, S., Tabe, M. and Sokai, T., Appl. Phys. Lett. 41, 86 (1982);Google Scholar
6aMano, T., Babee, T., Sawabe, H. and Imou, K., 1982 Symposium VLSI Technology, Kanagawa, Japan, Digest Tech. Papers, p. 12 (1982).Google Scholar
7. For recent review see Jastrzebski, L., J. Crystal Growth, December issue, (1983), in press.Google Scholar
8.Jastrzebski, L., Corboy, J. F., and Pagliaro, R. Jr., J. Electrochem. Soc. 129, 2645 (1982).Google Scholar
9.Jastrzebski, L., Corboy, J. F., McGinn, J. T. and Pagliaro, R. Jr., J. Electrochem. Soc. 130, 1571 (1983).Google Scholar
10.Cullen, G. W. and Wang, C. C., “Heteroepitaxial Semiconductors for Electronic Devices”, Springer-Verlag publisher (1978).Google Scholar
11.Claassen, W. A. P. and Bloem, J., J. Electrochem. Soc. 127, 194 (1980).Google Scholar
12.Jastrzebski, L., Corboy, J. F., private communication.Google Scholar
13.Jastrzebski, L., IEEE Trans. Electron Devices ED–29, 475 (1982).Google Scholar
14.McGinn, J. T., Jastrzebski, L., Corboy, J. F., J. Electrochem. Soc., in press.Google Scholar
15.Rothman, D. D., Silversmith, D. J. and Burns, J. A., J. Electrochem. Soc. 129, 2303 (1982).Google Scholar
16.Jastrzebski, L., RCA Rev. 44, 250 (1983).Google Scholar
17.Jastrzebski, L., Ipri, A., Corboy, J. F., and Metzl, R., 1983 Symposium on VLSI Technology, Digest Tech. Papers, pp. 50–52.Google Scholar
18.Abrahams, M. S. and Buiocchi, C. J., Appl. Phys. Lett. 27, 325 (1975).Google Scholar
19.Duffy, M.T., Corboy, J. F., Cullen, G. W., Smith, R. T., Soltis, R. A., Harbeke, G. and Blumenfeld, M., J. Crystal Growth 58, 10 (1982).Google Scholar
20.Duffy, M.T., Zanzucchi, P., Ham, W. E., Corboy, J. F., Cullen, G. W. and Smith, R. T., J. Crystal Growth 58, 19 (1982).Google Scholar
21.Haynes, P. E., 1983 IEEE SOS/SOI Technology Workshop, Oct. 1983, Jackson Hole, WY.Google Scholar
22.Golecki, I. and Nicolet, M. A., Solid State Electronics 23, 803 (1980);Google Scholar
22aInone, T. and Yoshii, T., Appl. Phys. Lett. 36, 64 (1980);Google Scholar
22bGolecki, I., Kinoshita, G., Gat, A. and Paine, B. M., Appl. Phys. Lett. 37, 919 (1980).Google Scholar
23.Ipri, A. C. in: Silicon Integrated Circuits - Part A, Kahng, D., ed. (Academic Press, New York, 1981) pp. 253395.Google Scholar
24.Tsaur, B-Y., Fan, J.C.C., Geis, M. W., Chapman, R. L., Brueck, S. R. J., Silversmith, D. J., and Mountain, R. W., Mat. Res. Soc. Symp. Proc. 13, 593603 (1983).Google Scholar
25.Taguchi, S., Yoshii, T., Uchida, Y., and Tango, H., 1981 Symposium on VLSI Technology, Digest Tech. Papers, pp. 92–93.Google Scholar
26.Jastrzebski, L., Ipri, A. C., and Corboy, J. F., IEEE Electron Dev. Lett. EDL–4, 3235 (1983).Google Scholar
27.Heiman, F. P., IEEE Trans. Electron Dev. ED–14, 781784 (1967).Google Scholar
28.McGreivy, D. J., IEEE Trans. Electron Dev. ED–24, 730738 (1977).Google Scholar
29.Heiman, F. P., Appl. Phys. Lett. 11, 132134 (1967).Google Scholar
30.Goodman, A. M., IEEE Trans. Electron Dev. ED–22, 6365 (1975).Google Scholar
31.Goodman, A. M. and Weitzel, C. E., IEEE Trans. Electron Dev. ED–24, 215218 (1977).Google Scholar
32.Repace, J. L. and Goodman, A. M., IEEE Trans. Electron Dev. ED–25, 978982 (1978);Google Scholar
32a see also: Tseng, W. F., Repace, J. L., Hughes, H. L., and Christou, A., Thin Solid Films 82, 213216 (1981).Google Scholar
33.Le, H. P. and Lam, H. W., IEEE Elec. Dev. Lett. EDL–3, 161163 (1982).Google Scholar
34.Nakashima, S. and Ohwada, K., Japan J. Appl. Phys. 22, 11191124 (1983).Google Scholar
35.Kjar, R. A. and Peel, J., IEEE Trans. Nucl. Sci. NS–21, 208210 (1974).Google Scholar
36.Lee, S. N., Kjar, R. A., and Kinoshita, G., IEEE Trans. Electron Dev. ED–25, 971978 (1978).Google Scholar
37.Gupta, A., Li, M. F., Yu, K. K., Su, S. C., Pandya, P., and Yang, H. B., 1981 IEDM Tech. Digest, pp. 616–619.Google Scholar
38.Tihanyi, J. and Schlotterer, H., Solid-State Electronics 18, 309314 (1975);Google Scholar
38aIEEE Trans. Electron Dev. ED–22, 10171023 (1975).Google Scholar
39.Schwob, P., Villoz, M., Jaquet, C. E., and Raulet, M. E., Rev. Phys. Appl. 13, 603607 (1978).Google Scholar
40.Sasaki, N., Nakano, M., Iwai, T., and Togei, R., 1978 IEDM Tech. Digest, pp. 356–359.Google Scholar
41.El-Mancy, Y. A. and Caughey, D. M., IEEE Trans. Electron Dev. ED–24, 11481153 (1977).Google Scholar
42.Eaton, S. S. and Lalevic, B., IEEE Trans. Electron Dev. ED–25, 907912 (1978).Google Scholar
43.Cobbold, R. S. C., Theory and Applications of Field-Effect Transistors (Wiley-Interscience, New York, 1970) Chapter 8.Google Scholar
44.Dang, R. L. M. and Shigyo, N., IEEE Electron Dev. Lett. EDL–2, 196 (1981).Google Scholar
45.Brucker, G. J., private communication (Oct. 1983);Google Scholar
45a see also: Berger, R., Shevchenko, A., Brucker, G. J., Kennerud, R., Measel, P., and Wahlin, K., IEEE Trans. Nucl. Sci. NS–30 (Dec. 1983, in press).Google Scholar
46.Smeltzer, R. K., private communication (Oct. 1983).Google Scholar
47.Napoli, L. S., Smeltzer, R. K., Yeh, J. L., and Heagerty, W. F., IEEE Trans. Nucl. Sci. NS–29, 17071711 (1982).Google Scholar
48.Kokkas, A. G., “Silicon/Sapphire Interface Radiation Study”, Scientific Report RADC-TR-77–138, prepared under contract F19628–76-C-0183 for RADC, Hanscom AFB, NFB (April 1977).Google Scholar
49.Tsaur, B-Y., Fan, J.C.C., Turner, G. W., and Silversmith, D. J., IEEE Electron Dev. Lett. EDL–3, 195197 (1982).Google Scholar
50.Davis, G. E., Hughes, H. L., and Kamins, T. I., IEEE Trans. Nucl. Sci. NS–29, 16851689 (1982).Google Scholar