Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-23T12:49:31.459Z Has data issue: false hasContentIssue false
  • English
  • Français

Correlation of Stress and Phase Evolution in Thin Ta Films On Si (100) During Thermal Testing

Published online by Cambridge University Press:  11 February 2011

B. L. French  and
J. C. Bilello
B. L. French
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109–2136.
J. C. Bilello
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109–2136.
Get access

Abstract

In this study the stress and morphology of Ta coatings sputtered on Si (100) substrates were monitored in situ and in real-time during thermal testing to allow interruptions at critical events in the coatings' stress evolution. These observations were carried out using white beam Laue transmission diffraction topography/radiography and a high-temperature sample stage at the Stanford Synchrotron Radiation Laboratory (SSRL). The structure of specimens from interrupted thermal tests was then analyzed using x-ray diffraction θ-2θ scans. The structure and phases present in the film at different stages of the thermal test were correlated with specific mechanical responses in the coating such as stress generation. This information was employed to elucidate the role of phase evolution in the respective stress responses of films deposited in high and low-pressure regimes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 750: Symposium Y – Surface Engineering 2002–Synthesis, Characterization and Applications , 2002 , Y8.8
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Clevenger, L. A., Mutscheller, A., Harper, J. M. E., Cabral, C. Jr, and Barmak, K., J. App Phys. 72 (10), 4918 (1992).Google Scholar
2. Balluffi, R. W. and Blakely, J. M., Thin Solid Films 25, 363 (1975).Google Scholar
3. Stavrev, M., Fischer, D., Wenzel, C., Drescher, K., and Mattern, N., Thin Solid Films 307, 79 (1997).Google Scholar
4. French, B. L. and Bilello, J. C. in Thin Films - Stresses and Mechanical Properties IX, edited by Ozkan, C. S., Freund, L. B., Cammarata, R. C., and Gao, H. (Mater. Res. Soc. Proc. 695, Pittsburgh, PA, 2002), pp. 385–390.Google Scholar
5. French, B. L. and Bilello, J. C., submitted to Thin Solid Films.Google Scholar
6. Kuo, C. L., Vanier, P. E., and Bilello, J. C., J. Appl. Phys. 55 (2), 375 (1984).Google Scholar
7. Stoney, G. G., Proc. Roy. Soc. Ser A 82, 172 (1909).Google Scholar
8. Hoffman, D. W., in Physics of Thin Films, edited by Haas, G. and Thun, R. E. (Academic Press, New York, 1965), Vol. 3, p. 211.Google Scholar
9. Zhao, Z. B., Rek, Z. U., and Bilello, J. C., Phil. Trans. R. Soc. Lond. A 357, 2681 (1999).Google Scholar
10. French, B. L. and Bilello, J. C., submitted to J. App. Phys.Google Scholar
11. Stringer, J., in High-Temperature Materials Coatings and Surface Interactions, edited by Newkirk, J. B. (Freund Publishing House, Tel-Aviv, Israel, 1980), p.163.Google Scholar
12. Thornton, J. A., J. Vac. Sci. Technol. A 4 (6), 3059 (1986).Google Scholar
13. Balzar, D., in Defect and Microstructure Analysis by Diffraction, edited by Snyder, R. L., Bunge, H. J., and Fiala, J. (International Union of Crystallography monographs on crystallography 10, Oxford University Press, New York, 1999).Google Scholar